对苯二胺改性石墨烯/环氧树脂复合材料的热导率研究

Study on Thermal Conductivity of P-Phenylenediamine Modified Graphene/Epoxy Composites.

作者信息

Lin Jun, Zhou Jiancheng, Guo Mengyao, Chen Danqing, Chen Guohua

机构信息

Xiamen Key Laboratory of Polymers & Electronic Materials, College of Materials Science and Engineering, Huaqiao University, 668 Jimei Blvd, Xiamen 361000, China.

出版信息

Polymers (Basel). 2022 Sep 3;14(17):3660. doi: 10.3390/polym14173660.

DOI:10.3390/polym14173660

PMID:36080735

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9460322/

Abstract

Thermal management has become an important requirement for many types of electrical equipment due to the development of integrated circuits. In this study, modified and reduced graphene fillers were synthesized in two steps, and then epoxy resin was filled through the evaporation of the solvent. The interfacial thermal resistance between the filler and matrix material was lowered by including amino groups to improve graphene compatibility in the epoxy resin. Furthermore, the reduction procedure was shown to have the potential to fix graphene oxide flaws, thereby improving thermal stability, electrical conductivity, and thermal conductivity of the composites. As a result, the thermal conductivity of the composite reached 1.7 W/mK, which is 750% higher than that of pure epoxy resin, and it was still insulated.

摘要

由于集成电路的发展，热管理已成为许多类型电气设备的一项重要要求。在本研究中，分两步合成了改性和还原的石墨烯填料，然后通过溶剂蒸发填充环氧树脂。通过引入氨基降低填料与基体材料之间的界面热阻，以提高石墨烯在环氧树脂中的相容性。此外，还原过程显示出修复氧化石墨烯缺陷的潜力，从而提高了复合材料的热稳定性、导电性和导热性。结果，复合材料的导热率达到1.7W/mK，比纯环氧树脂高750%，且仍具有绝缘性。