Facile Electroless Plating Method to Fabricate a Nickel-Phosphorus-Modified Copper Current Collector for a Lean Lithium-Metal Anode.

The compatibility of current collectors with reactive Li is key to inducing stable Li cycling and prolonged cycle life of lean Li-metal batteries. Herein, a thin and uniform layer of Ni-P complex was built on the surface of a Cu current collector (NiP@Cu) via an efficient, controllable, and cost-effective electroless plating method. The thickness, morphology, composition, and roughness of the Ni-P deposition were successfully regulated. Lithiophilicity of the current collector was greatly improved by Ni-P deposition, which effectively reduced the Li nucleation overpotential and suppressed the Li dendrite growth. In addition, NiP@Cu promoted an inorganic LiF/LiP-rich solid electrolyte interphase to facilitate interfacial charge transfer and eliminate excessive side reactions between Li and the electrolyte. As a result, the Coulombic efficiency of half-cells remained above 98.5% for more than 400 cycles at 0.5 mA/cm and 98.2% for more than 250 cycles at 1 mA/cm. Full cells with NiP@Cu also showed superior performance compared to those with bare Cu. This work proposes a promising surface modification method to develop a stable, dendrite-free, and cost-effective anode current collector for high-energy-density lean Li-metal batteries.