Kawamura Midori, Toida Yu, Hoshika Shuhei, Islam Md Refat Readul, Li Yitong, Yao Ye, Liu Yunqing, Islam Rafiqul, Sato Takaaki, Shimada Yasushi, Sano Hidehiko
Department of Restorative Dentistry, Graduate School of Dental Medicine, Hokkaido University, Kita 13 Nishi 7, Sapporo 060-8586, Japan.
Department of Dental Medical Laboratory, Hokkaido University Hospital, Kita 14 Nishi 5, Sapporo 060-8648, Japan.
Polymers (Basel). 2022 Sep 28;14(19):4075. doi: 10.3390/polym14194075.
The purpose of this study was to evaluate the microtensile bond strength (µTBS) and Knoop hardness number (KHN) of a novel experimental light-cured resin cement (HL). Eighteen flat dentin surfaces of human molars were polished using #600 SiC paper and bonded to CAD/CAM resin blocks with the respective resin cements and composites: HL, Panavia V5 (PV), and Clearfil AP-X (AP). All specimens were stored in distilled water at 37 °C for 24 h and 7 days. Scanning electron microscope (SEM) and energy dispersive X-ray (EDX) observations were performed to evaluate filler morphology and to detect the elements. The resin cements had a significant effect on the immediate µTBS (F = 22.59, p < 0.05) and after water storage µTBS (F = 22.83, p < 0.05). Significant differences (p < 0.05) in the KHN between the tested materials were observed, and HL indicated the highest KHN when compared with PV. HL showed a combination of the regular-shaped filler and spherical-shaped filler within the matrix. Silicon was detected in HL from the EDX evaluation. HL exhibited better bonding performance and polymerization, which may have contributed to the improvement of the adhesive strength.
本研究的目的是评估一种新型实验性光固化树脂水门汀(HL)的微拉伸粘结强度(µTBS)和努氏硬度值(KHN)。用人磨牙的18个平坦牙本质表面,使用#600碳化硅砂纸进行抛光,并用相应的树脂水门汀和复合材料粘结到CAD/CAM树脂块上:HL、帕纳维亚V5(PV)和Clearfil AP-X(AP)。所有标本在37℃的蒸馏水中储存24小时和7天。进行扫描电子显微镜(SEM)和能量色散X射线(EDX)观察,以评估填料形态并检测元素。树脂水门汀对即刻µTBS(F = 22.59,p < 0.05)和水储存后的µTBS(F = 22.83,p < 0.05)有显著影响。观察到测试材料之间的KHN存在显著差异(p < 0.05),与PV相比,HL的KHN最高。HL在基质中显示出规则形状填料和球形填料的组合。通过EDX评估在HL中检测到硅。HL表现出更好的粘结性能和聚合作用,这可能有助于提高粘结强度。