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骨芯片平台与集成生物传感器:迈向具有实时生物传感功能的先进体外骨模型。

Bone-on-a-chip platforms and integrated biosensors: Towards advanced in vitro bone models with real-time biosensing.

作者信息

Zhang Yang, Yu Taozhao, Ding Jingyi, Li Zida

机构信息

School of Dentistry, Health Science Center, Shenzhen University, Shenzhen, 518060, China; School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, 518060, China.

School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, 518060, China; Guangdong Key Laboratory for Biomedical Measurements and Ultrasound Imaging, School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, 518060, China.

出版信息

Biosens Bioelectron. 2023 Jan 1;219:114798. doi: 10.1016/j.bios.2022.114798. Epub 2022 Oct 13.

Abstract

Bone diseases, such as osteoporosis and bone defects, often lead to structural and functional deformities of the patient's body. Understanding the complicated pathophysiology and finding new drugs for bone diseases are in dire need but challenging with the conventional cell and animal models. Bone-on-a-chip (BoC) models recapitulate key features of bone at an unprecedented level and can potentially shift the paradigm of future bone research and therapeutic development. Nevertheless, current BoC models predominantly rely on off-chip analysis which provides only endpoint measurements. To this end, integrating biosensors within the BoC can provide non-invasive, continuous monitoring of the experiment progression, significantly facilitating bone research. This review aims to summarize research progress in BoC and biosensor integrations and share perspectives on this exciting but rudimentary research area. We first introduce the research progress of BoC models in the study of bone remodeling and bone diseases, respectively. We then summarize the need for BoC characterization and reported works on biosensor integration in organ chips. Finally, we discuss the limitations and future directions of BoC models and biosensor integrations as next-generation technologies for bone research.

摘要

诸如骨质疏松症和骨缺损等骨疾病,常常导致患者身体出现结构和功能畸形。了解复杂的病理生理学并找到治疗骨疾病的新药迫在眉睫,但使用传统的细胞和动物模型却颇具挑战。芯片上的骨(BoC)模型以前所未有的水平重现了骨的关键特征,并有可能改变未来骨研究和治疗开发的模式。然而,目前的BoC模型主要依赖芯片外分析,这种分析仅提供终点测量。为此,在BoC中集成生物传感器可以对实验进程进行非侵入性的连续监测,极大地促进骨研究。本综述旨在总结BoC与生物传感器集成方面的研究进展,并分享对这个令人兴奋但尚处于初级阶段的研究领域的看法。我们首先分别介绍BoC模型在骨重塑和骨疾病研究中的进展。然后,我们总结了BoC表征的必要性以及在器官芯片中生物传感器集成方面的已报道工作。最后,我们讨论了BoC模型和生物传感器集成作为骨研究下一代技术的局限性和未来方向。

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