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金丝球焊及其在高温环境下的可靠性测试

Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment.

作者信息

Wu Chenyang, Wang Junqiang, Liu Xiaofei, Li Mengwei, Zhu Zehua, Qi Yue

机构信息

Notional Key Laboratory of Instrumentation Science & Dynamic Measurement, Taiyuan 030051, China.

Academy for Advanced Interdisciplinary Research, North University of China, Taiyuan 030051, China.

出版信息

Micromachines (Basel). 2022 Sep 27;13(10):1603. doi: 10.3390/mi13101603.

Abstract

The long-term application of sensors in a high-temperature environment needs to address several challenges, such as stability at high temperatures for a long time, better wiring interconnection of sensors, and reliable and steady connection of the sensor and its external equipment. In order to systematically investigate the reliability of thin coatings at high temperatures for a long time, Au and Cr layers were deposited on silicon substrates by magnetron sputtering. Additionally, samples with different electrode thicknesses were annealed at different temperatures for a varied duration to study the effect of electrode thickness, temperature, and duration on the reliability of samples. The results of tensile and probe tests before and after heat treatment revealed that the mechanical strength and electrical properties have changed after annealing. In addition, the bonding interface was analyzed by a cross-sectional electron microscope. The analysis showed that long-term continuous high-temperature exposure would result in thinning of the electrode, formation of pores, recrystallization, and grain growth, all of which can affect the mechanical strength and electrical properties. In addition, it was observed that increasing the thickness of the gold layer will improve reliability, and the test results show that although the thin metal layer sample is in poor condition, it is still usable. The present study provides theoretical support for the application of thin coatings in high temperatures and harsh environments.

摘要

传感器在高温环境下的长期应用需要应对若干挑战,例如长时间在高温下的稳定性、传感器更好的布线互连以及传感器与其外部设备可靠且稳定的连接。为了系统地研究薄涂层在高温下长时间的可靠性,通过磁控溅射在硅基板上沉积了金层和铬层。此外,对具有不同电极厚度的样品在不同温度下进行不同时长的退火处理,以研究电极厚度、温度和时长对样品可靠性的影响。热处理前后的拉伸和探针测试结果表明,退火后机械强度和电学性能发生了变化。此外,通过截面电子显微镜对键合界面进行了分析。分析表明,长期持续的高温暴露会导致电极变薄、形成孔隙、再结晶以及晶粒生长,所有这些都会影响机械强度和电学性能。此外,观察到增加金层厚度会提高可靠性,测试结果表明,尽管薄金属层样品状况不佳,但仍可使用。本研究为薄涂层在高温和恶劣环境中的应用提供了理论支持。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8846/9609227/e88821ee1719/micromachines-13-01603-g001.jpg

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