Gulsaran Ahmet, Bastug Azer Bersu, Ozyigit Dogu, Saritas Resul, Kocer Samed, Abdel-Rahman Eihab, Yavuz Mustafa
Mechanical and Mechatronics Engineering Department, University of Waterloo, Waterloo, ON N2L 3G1, Canada.
Waterloo Institute for Nanotechnology (WIN), University of Waterloo, Waterloo, ON N2L 3G1, Canada.
Micromachines (Basel). 2023 Jul 22;14(7):1473. doi: 10.3390/mi14071473.
Conventional packaging and interconnection methods for two-terminal devices, e.g., diodes often involve expensive and bulky equipment, introduce parasitic effects and have reliability issues. In this study, we propose a built-in packaging method and evaluate its performance compared to probing and wire bonding methods. The built-in packaging approach offers a larger overlap area, improved contact resistance, and direct connection to testing equipment. The experimental results demonstrate a 12% increase in current, an 11% reduction in resistance, and improved performance of the diode. The proposed method is promising for enhancing sensing applications, wireless power transmission, energy harvesting, and solar rectennas. Overall, the built-in packaging method offers a simpler, cheaper, more compact and more reliable packaging solution, paving the way for more efficient and advanced technologies in these domains.
两终端器件（如二极管）的传统封装和互连方法通常需要昂贵且笨重的设备，会引入寄生效应并存在可靠性问题。在本研究中，我们提出了一种内置封装方法，并将其与探针法和引线键合法相比评估其性能。内置封装方法提供了更大的重叠面积、更低的接触电阻以及与测试设备的直接连接。实验结果表明电流增加了12%，电阻降低了11%，并且二极管的性能得到了改善。所提出的方法对于增强传感应用、无线电力传输、能量收集和太阳能整流天线很有前景。总体而言，内置封装方法提供了一种更简单、更便宜、更紧凑且更可靠的封装解决方案，为这些领域中更高效和先进的技术铺平了道路。
