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使用硫代氨基脲连接的3-乙酰基吡啶对盐酸中铜的耐腐蚀性进行重量法和电化学统计优化。

Gravimetric and electrochemical statistical optimizations for improving copper corrosion resistance in hydrochloric acid using thiosemicarbazone-linked 3-acetylpyridine.

作者信息

Mohamad Alwi Muhammad Ammar, Ahmad Mohammad Norazmi, Misnon Izan Izwan, Pauzi Hariy, Normaya Erna

机构信息

Experimental and Theoretical Research Lab, Department of Chemistry, Kulliyyah of Science, International Islamic University of Malaysia 25200 Kuantan Pahang Malaysia

Faculty of Industrial Sciences & Technology, Universiti Malaysia Pahang Lebuhraya Tun Razak, Gambang 26300 Kuantan Pahang Malaysia

出版信息

RSC Adv. 2022 Sep 29;12(43):27793-27808. doi: 10.1039/d2ra05192c. eCollection 2022 Sep 28.

DOI:10.1039/d2ra05192c
PMID:36320253
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9520678/
Abstract

Thiosemicarbazone-linked 3-acetylpyridine (T3AP), was synthesized and tested on copper strips in hydrochloric acid. Gravimetric measurements and electrochemical impedance spectroscopy were used to investigate the optimized inhibitory behavior of T3AP using the response surface methodology (RSM), with the optimized result obtained using a temperature of 42.90 °C, acid concentration of 2.38 M, inhibitor concentration of 3.80 mM, and time of 18.97 h, with inhibition efficiency up to approximately 93%. Validation of the experimental and predicted RSM showed that no significant difference in the inhibition efficiency with the confidence level value up to 97% was obtained. The isotherm study shows that T3AP obeys the Langmuir isotherm adsorption model, with physisorption and chemisorption adsorption mechanisms. The effectiveness of inhibitor performance of T3AP can be visually observed using scanning electron microscopy and X-ray photoelectron spectroscopy. The characterization revealed that the reactive S and N atoms in the T3AP inhibitor form strong chemical adsorption through N-Cu and Cu-S bonds on the copper surface. Computational analysis was also carried out, and we found that the stable energy gap between the occupied and unoccupied molecular orbitals (4.6891 eV) and high binding energy (540.962 kJ mol) adsorption from molecular dynamics were in agreement with the experimental findings.

摘要

合成了硫代氨基脲连接的3-乙酰吡啶(T3AP),并在盐酸中的铜片上进行了测试。采用重量法和电化学阻抗谱,利用响应面法(RSM)研究了T3AP的最佳抑制行为,在温度为42.90℃、酸浓度为2.38 M、抑制剂浓度为3.80 mM、时间为18.97 h的条件下获得了最佳结果,抑制效率高达约93%。实验和预测的RSM验证表明,在置信水平值高达97%时,抑制效率没有显著差异。等温线研究表明,T3AP服从朗缪尔等温线吸附模型,具有物理吸附和化学吸附机制。使用扫描电子显微镜和X射线光电子能谱可以直观地观察到T3AP抑制剂性能的有效性。表征显示,T3AP抑制剂中的活性S和N原子通过N-Cu和Cu-S键在铜表面形成强化学吸附。还进行了计算分析,我们发现占据和未占据分子轨道之间的稳定能隙(4.6891 eV)和分子动力学吸附的高结合能(540.962 kJ mol)与实验结果一致。

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