利用莫尔条纹和数字光栅的高精度晶圆键合对准标记

High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating.

作者信息

Fan Jianhan, Lu Sen, Zou Jianxiao, Yang Kaiming, Zhu Yu, Liao Kaiji

机构信息

School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China.

State Key Laboratory of Tribology, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China.

出版信息

Micromachines (Basel). 2022 Dec 7;13(12):2159. doi: 10.3390/mi13122159.

DOI:10.3390/mi13122159

PMID:36557458

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9782961/

Abstract

This paper investigates a moiré-based mark for high-precision wafer bonding alignment. During alignment, the mark is combined with digital grating, which has the benefits of high precision and small size. A digital grating is superimposed on the mark to generate moiré fringes. By performing a phase calculation on the moiré fringe images corresponding to the upper and lower wafers, the relative offset of the upper and lower wafers can be accurately calculated. These moiré fringes are exceptionally stable, thereby enhancing the alignment stability. In this study, through practical experiments, we tested the rationality and practicability of the mark.

摘要

本文研究了一种用于高精度晶圆键合对准的基于莫尔条纹的标记。在对准过程中，该标记与具有高精度和小尺寸优点的数字光栅相结合。将数字光栅叠加在标记上以产生莫尔条纹。通过对上下晶圆对应的莫尔条纹图像进行相位计算，可以精确计算出上下晶圆的相对偏移量。这些莫尔条纹非常稳定，从而提高了对准稳定性。在本研究中，通过实际实验，我们测试了该标记的合理性和实用性。