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基于非接触位置传感器的六自由度磁悬浮系统控制方法研究。

A Study on the Control Method of 6-DOF Magnetic Levitation System Using Non-Contact Position Sensors.

机构信息

School of Mechanical, Automotive and Robot Engineering, Halla University, Wonju 26404, Republic of Korea.

Vehicle Electrification Research Center, Korea Automotive Technology Institute, Daegu 43011, Republic of Korea.

出版信息

Sensors (Basel). 2023 Jan 12;23(2):905. doi: 10.3390/s23020905.

DOI:10.3390/s23020905
PMID:36679695
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9862467/
Abstract

Recently, due to the development of semiconductor technology, high-performance memory and digital convergence technology that integrates and implements various functions into one semiconductor chip has been regarded as the next-generation core technology. In the semiconductor manufacturing process, various motors are being applied for automated processes and high product reliability. However, dust and shaft loss due to mechanical friction of a general motor system composed of motor-bearing are problematic for semiconductor wafer processing. In addition, in the edge bread remove (EBR) process after the photoresist application process, a nozzle position control system for removing unnecessary portions of the wafer edge is absolutely necessary. Therefore, in this paper, in order to solve the problems occurring in the semiconductor process, a six-degrees-of-freedom (6-DOF) magnetic levitation system without shaft and bearing was designed for application to the semiconductor process system; and an integrated driving control algorithm for 6-DOF control (levitation, rotation, tilt (Roll-Pitch), X-Y axis movement) using the force of each current component derived through current vector control was proposed. Finally, the 6-DOF magnetic levitation system with the non-contact position sensors was fabricated and the validity of the 6-DOF magnetic levitation control method proposed in this paper was verified through a performance test using a prototype.

摘要

最近,由于半导体技术的发展,将各种功能集成并实现到一个半导体芯片中的高性能内存和数字融合技术已被视为下一代核心技术。在半导体制造过程中,各种电机正在被应用于自动化过程和提高产品可靠性。然而,由电机-轴承组成的普通电机系统的机械摩擦产生的灰尘和轴损失对半导体晶片处理是有问题的。此外,在应用光刻胶后的边缘面包去除(EBR)工艺中,绝对需要用于去除晶片边缘不必要部分的喷嘴位置控制系统。因此,在本文中,为了解决半导体工艺中出现的问题,设计了一种无轴和轴承的六自由度(6-DOF)磁悬浮系统,将其应用于半导体工艺系统;并提出了一种使用电流矢量控制得出的各电流分量的力实现 6-DOF 控制(悬浮、旋转、倾斜(滚转-俯仰)、X-Y 轴运动)的集成驱动控制算法。最后,制造了具有非接触位置传感器的 6-DOF 磁悬浮系统,并通过使用原型进行性能测试验证了本文提出的 6-DOF 磁悬浮控制方法的有效性。

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