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具有增强介电温度稳定性的可压缩聚合物复合材料。

Compressible Polymer Composites with Enhanced Dielectric Temperature Stability.

机构信息

State Key Lab of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing, 100084, China.

MOE Key Laboratory of Advanced Materials, Tsinghua University, Beijing, 100084, China.

出版信息

Adv Mater. 2023 Apr;35(16):e2209958. doi: 10.1002/adma.202209958. Epub 2023 Mar 6.

Abstract

High-dielectric-constant polymer composites have broad application prospects in flexible electronics and electrostatic energy storage capacitors. Substantial enhancement in dielectric constants (ε ) of polymer composites so far can only be obtained at a high loading of nanofillers, resulting in high dielectric loss and high elastic modulus of polymer composites. Addressing the polarization shielding and the consequent polarization discontinuity at polymer/filler interfaces has been a long-standing challenge to achieve flexible polymer composite with high ε . Herein, a polymer composite with interconnected BaTiO (BT) ceramic scaffold is proposed and demonstrated, which exhibits a high ε of ≈210 at a low BT volume fraction of ≈18 vol%, approaching the upper limit predicted by the parallel model. By incorporating relaxor Ba(Zr Ti )O phase in BT scaffold, dielectric temperature stability is further achieved with Δε below ±10% within a broad temperature range (25-140 °C). Moreover, the dielectric performances remain stable under a compressive strain of up to 80%. This work provides a facile approach to construct large-scale polymer composites with robust dielectric performance against changes in thermal and mechanical conditions, which are promising for high-temperature applications in flexible electronics.

摘要

高介电常数聚合物复合材料在柔性电子和静电储能电容器方面具有广阔的应用前景。迄今为止,在高纳米填料负载量下才能使聚合物复合材料的介电常数(ε)得到实质性提高,这导致聚合物复合材料的介电损耗和弹性模量较高。解决聚合物/填料界面的极化屏蔽以及由此产生的极化不连续性,一直是实现具有高ε的柔性聚合物复合材料的一个长期挑战。在此,提出并展示了一种具有互连 BaTiO(BT)陶瓷支架的聚合物复合材料,其在低 BT 体积分数(≈18 vol%)下表现出 ≈210 的高 ε,接近平行模型预测的上限。通过在 BT 支架中掺入弛豫 Ba(ZrTi)O 相,进一步实现了介电温度稳定性,在较宽的温度范围内(25-140°C)Δε低于 ±10%。此外,在高达 80%的压缩应变下,介电性能仍保持稳定。这项工作提供了一种简便的方法来构建具有对热和机械条件变化具有稳健介电性能的大规模聚合物复合材料,有望在柔性电子的高温应用中得到应用。

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