Functional Laboratory of Laser and Terahertz Technology, Wuhan National Laboratory for Optoelectronics (WNLO), Huazhong University of Science and Technology (HUST), Wuhan, Hubei430074, PR China.
No. 29 Research Institute, China Electronics Technology Group Corporation, Chengdu, Sichuan610036, PR China.
Langmuir. 2023 Feb 7;39(5):2063-2072. doi: 10.1021/acs.langmuir.2c03293. Epub 2023 Jan 26.
In recent years, selective metallization on polymer surfaces has attracted considerable attention due to its excellent properties and wide applications. This paper reports that copper phosphate (Cu(PO)) or nickel phosphate (Ni(PO)) was selected as laser-active material to successfully fabricate metallic patterns on ordinary polymer substrates by laser direct activation and electroless plating. Scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were utilized to characterize the interaction mechanism between a nanosecond-pulsed laser (355 and 1064 nm wavelengths) and Cu(PO) or Ni(PO). It was found that after 355 or 1064 nm laser activation with appropriate parameters, Cu was generated from Cu(PO), and NiO was generated from Ni(PO). At the same time, Cu or NiO adsorbed on the porous sponge-like microstructure of modified polycarbonate (PC), respectively, and acted as catalytic active centers to realize selective copper deposition in the laser-activated zone. Furthermore, the obtained copper layers were confirmed to possess good selectivity, electrical conductivity, and high adhesion strength (the highest grade of 5B). Moreover, from comparisons of Cu(PO) with Ni(PO) and of 355 nm laser activation with 1064 nm laser activation, the 1064 nm laser activation of Cu(PO) produced the most catalytic seeds (Cu) and had the best catalytic effect.
近年来，由于其优异的性能和广泛的应用，聚合物表面的选择性金属化引起了相当大的关注。本文报道了选择磷酸铜（Cu（PO））或磷酸镍（Ni（PO））作为激光活性材料，通过激光直接激活和化学镀成功地在普通聚合物基底上制备金属图案。利用扫描电子显微镜（SEM）和 X 射线光电子能谱（XPS）来表征纳秒脉冲激光（355nm 和 1064nm 波长）与 Cu（PO）或 Ni（PO）之间的相互作用机制。结果发现，在适当参数的 355nm 或 1064nm 激光激活后，Cu 由 Cu（PO）生成，NiO 由 Ni（PO）生成。同时，Cu 或 NiO 分别吸附在改性聚碳酸酯（PC）的多孔海绵状微结构上，作为催化活性中心，在激光激活区实现了铜的选择性沉积。此外，所得铜层具有良好的选择性、导电性和高结合强度（最高等级为 5B）。此外，通过对 Cu（PO）与 Ni（PO）的比较以及 355nm 激光激活与 1064nm 激光激活的比较，发现 1064nm 激光激活的 Cu（PO）产生了最多的催化种子（Cu），具有最好的催化效果。
