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构建具有热导和电导性能的三明治结构聚(乙烯醇)复合薄膜。

Constructing Sandwich-Structured Poly(vinyl alcohol) Composite Films with Thermal Conductive and Electrical Performance.

机构信息

State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China.

School of Electrical Engineering, Xi'an Jiaotong University, Xi'an 710049, China.

出版信息

ACS Appl Mater Interfaces. 2023 Mar 8;15(9):12315-12326. doi: 10.1021/acsami.2c20668. Epub 2023 Feb 22.

DOI:10.1021/acsami.2c20668
PMID:36812424
Abstract

With the miniaturization and high integration development in microelectronic devices, the problem of heat dissipation has attracted widespread attention. Highly thermal conductive and electrical insulation polymer composites show great advantages to solve the problems of heat dissipation. Nevertheless, the fabrication of polymer composites with both excellent thermal conductivity and electrical performance is still a great challenge. Herein, to coordinate the thermal and electrical properties of the composite film, the sandwich-structured poly(vinyl alcohol) (PVA)/boron phosphide (BP)-boron nitride nanosheet (BNNS) composite films were prepared, with the PVA/BP composite film as the top and bottom layers and the BNNS layer as the middle layer. When the filler loading was 31.92 wt %, the sandwich-structured composite films showed excellent in-plane thermal conductivity (9.45 W·m·K), low dielectric constant (1.25 at 10 Hz), and excellent breakdown strength. In the composite film, the interconnected BP particles and BNNS layer formed several heat dissipation pathways to increase the thermal conductivity, while the insulated BNNS layer hampered the electron transformation to enhance the electrical resistivity of films. Therefore, the PVA/BP-BNNS composite films showed a potential application in heat dissipation of high power electronic devices.

摘要

随着微电子器件的小型化和高度集成化发展,散热问题引起了广泛关注。高热导率和电绝缘的聚合物复合材料在解决散热问题方面显示出巨大的优势。然而,制造具有优异导热和电性能的聚合物复合材料仍然是一个巨大的挑战。在此,为了协调复合膜的热学和电学性能,制备了具有三明治结构的聚(聚乙烯醇)(PVA)/磷化硼(BP)-氮化硼纳米片(BNNS)复合膜,其中 PVA/BP 复合膜作为顶层和底层,BNNS 层作为中间层。当填料负载为 31.92wt%时,三明治结构的复合膜表现出优异的面内热导率(9.45W·m·K)、低介电常数(10Hz 时为 1.25)和优异的击穿强度。在复合膜中,相互连接的 BP 颗粒和 BNNS 层形成了几个散热途径,以提高热导率,而绝缘 BNNS 层阻碍了电子的转变,从而提高了薄膜的电阻率。因此,PVA/BP-BNNS 复合膜在高功率电子器件的散热方面具有潜在的应用前景。

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