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3D打印型腔工艺中材料选择、填充率和层高对熔模铸造中打印图案及铸造产品表面粗糙度的影响

Influences of Material Selection, Infill Ratio, and Layer Height in the 3D Printing Cavity Process on the Surface Roughness of Printed Patterns and Casted Products in Investment Casting.

作者信息

Nguyen Thanh Tan, Tran Van Tron, Pham Thi Hong Nga, Nguyen Van-Thuc, Thanh Nguyen Chi, Thi Hong Minh Nguyen, Duy Nguyen Vu Anh, Thanh Duy Nguyen, Nguyen Van Thanh Tien

机构信息

Faculty of Mechanical Engineering, Ho Chi Minh City University of Technology and Education, Ho Chi Minh City 71307, Vietnam.

Faculty of Applied Science, Ho Chi Minh City University of Technology and Education, Ho Chi Minh City 71307, Vietnam.

出版信息

Micromachines (Basel). 2023 Feb 5;14(2):395. doi: 10.3390/mi14020395.

DOI:10.3390/mi14020395
PMID:36838095
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9965826/
Abstract

As 3D-printed (3DP) patterns are solid and durable, they can be used to create thin wall castings, which is complicated with wax patterns because of the wax's fragility and high shrinkage ratio. According to this study's experiment results, polylactic acid (PLA), polyvinyl butyral (PVB), and castable wax (CW) are suitable materials for preparing investment casting (IC) cavities. The results indicate that the casting product with the highest-quality surface is obtained using a cavity prepared using a CW-printed pattern. PLA- and PVB-printed patterns provide a good surface finish for casted products. In addition, the roughness of both the printed and casted surfaces increases as the printing layer height increases. The roughness of the casted surface varies from 2.25 μm to 29.17 μm. This investigation also considers the correlation between the infill ratio and mechanical properties of PLA-printed patterns. An increase in the infill ratios from 0% to 100% leads to a significant increase in the tensile properties of the PLA-printed pattern. The obtained results can be practically used.

摘要

由于3D打印（3DP）模型坚固耐用，它们可用于制造薄壁铸件，而蜡模因其易碎性和高收缩率，制造薄壁铸件较为复杂。根据本研究的实验结果，聚乳酸（PLA）、聚乙烯醇缩丁醛（PVB）和铸造蜡（CW）是制备熔模铸造（IC）型腔的合适材料。结果表明，使用CW打印模型制备的型腔可获得表面质量最高的铸造产品。PLA和PVB打印模型为铸造产品提供了良好的表面光洁度。此外，随着打印层高的增加，打印表面和铸造表面的粗糙度均增大。铸造表面的粗糙度在2.25μm至29.17μm之间变化。本研究还考虑了PLA打印模型的填充率与力学性能之间的相关性。填充率从0%增加到100%会导致PLA打印模型的拉伸性能显著提高。所获得的结果具有实际应用价值。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/10975895180f/micromachines-14-00395-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/24e8ebf4932f/micromachines-14-00395-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/146ce7bba8ef/micromachines-14-00395-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/b35d96620630/micromachines-14-00395-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/05af4eeb4d29/micromachines-14-00395-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/5aaf934605e2/micromachines-14-00395-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/09754dcbdbd0/micromachines-14-00395-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/898146b2ca38/micromachines-14-00395-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/a96632c0618c/micromachines-14-00395-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/10975895180f/micromachines-14-00395-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/24e8ebf4932f/micromachines-14-00395-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/146ce7bba8ef/micromachines-14-00395-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/b35d96620630/micromachines-14-00395-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/05af4eeb4d29/micromachines-14-00395-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/5aaf934605e2/micromachines-14-00395-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/09754dcbdbd0/micromachines-14-00395-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/898146b2ca38/micromachines-14-00395-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/a96632c0618c/micromachines-14-00395-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5206/9965826/10975895180f/micromachines-14-00395-g009.jpg

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