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通过无压烧结制备的具有高抗压强度和低导热率的双孔隙率(TaNbTiZrHf)C高熵陶瓷

Dual-Porosity (TaNbTiZrHf)C High-Entropy Ceramics with High Compressive Strength and Low Thermal Conductivity Prepared by Pressureless Sintering.

作者信息

Yang Qian, Li Cuiyan, Ouyang Haibo, Gao Ruinan, Shen Tianzhan, Huang Jianfeng

机构信息

Key Laboratory for Green Manufacturing & Functional Application of Inorganic Materials, School of Materials Science and Engineering, Shaanxi University of Science and Technology, Xi'an 710021, China.

出版信息

Materials (Basel). 2023 Mar 21;16(6):2495. doi: 10.3390/ma16062495.

Abstract

Porous (TaNbTiZrHf)C high-entropy ceramics (HEC) with a dual-porosity structure were fabricated by pressureless sintering using a mixture powder of ceramic precursor and SiO microspheres. The carbothermal reduction in the ceramic precursor led to the formation of pores with sizes of 0.4-3 μm, while the addition of SiO microspheres caused the appearance of pores with sizes of 20-50 μm. The porous HECs exhibit competitive thermal insulation (4.12-1.11 W·m k) and extraordinary compressive strength (133.1-41.9 MPa), which can be tailored by the porosity of the ceramics. The excellent properties are ascribed to the high-entropy effects and dual-porosity structures. The severe lattice distortions in the HECs lead to low intrinsic thermal conductivity and high compressive strength. The dual-porosity structure is efficient at phonon scattering and inhabiting crack propagations, which can further improve the thermal insulation and mechanical properties of the porous HECs.

摘要

采用陶瓷前驱体与SiO微球的混合粉末通过无压烧结制备了具有双孔隙结构的多孔(TaNbTiZrHf)C高熵陶瓷(HEC)。陶瓷前驱体中的碳热还原导致形成尺寸为0.4 - 3μm的孔隙,而SiO微球的加入则导致出现尺寸为20 - 50μm的孔隙。多孔HEC表现出具有竞争力的隔热性能(4.12 - 1.11W·m⁻¹·K⁻¹)和出色的抗压强度(133.1 - 41.9MPa),这可以通过陶瓷的孔隙率进行调整。这些优异性能归因于高熵效应和双孔隙结构。HEC中严重的晶格畸变导致低本征热导率和高抗压强度。双孔隙结构在声子散射和抑制裂纹扩展方面效率很高,这可以进一步提高多孔HEC的隔热和力学性能。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/67bd/10052925/1e8f9855ea33/materials-16-02495-g001.jpg

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