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基于互穿聚合物网络结构的三重形状记忆氰酸酯基复合材料的 4D 打印。

4D Printing of Triple-Shape Memory Cyanate Composites Based on Interpenetrating Polymer Network Structures.

机构信息

Centre for Composite Materials and Structures, Harbin Institute of Technology (HIT), No. 2 Yikuang Street, Harbin 150080, People's Republic of China.

出版信息

ACS Appl Mater Interfaces. 2023 May 3;15(17):21496-21506. doi: 10.1021/acsami.3c01750. Epub 2023 Apr 21.

Abstract

The triple-shape memory polymer (TSMP) can be programmed into two temporary shapes (S and S) and shows an ordinal recovery from S to S and eventually to the permanent shape upon heating, which realizes more complex stimulus-response motions. We introduced a novel strategy for forming triple-shape memory cyanate ester (TSMCE) resins with high strength and fracture toughness via three-step curing, including four-dimensional (4D) printing, UV post-curing, and thermal curing. The obtained TSMCE resins presented two separated glass transition temperature () regions due to the formation of an interpenetrating polymer network (IPN), which successfully endowed the polymers with the triple-shape memory effect. The two increased with the increasing cyanate ester (CE) prepolymer content; their ranges were 82.7-102.1 °C and 164.4-229.0 °C, respectively. The fracture strain of the IPN CE resin was up to 10.9%. Moreover, the cooperation of short carbon fibers (CFs) and glass fibers (GFs) with the polymer-accelerated phase separation resulted in two well-separated peaks exhibiting better excellent triple-shape memory behaviors and fracture toughness. The strategy for combining the IPN structure and 4D printing provides insight into the preparation of shape memory polymers integrating high strength and toughness, multiple-shape memory effect, and multifunctionality.

摘要

三重形状记忆聚合物(TSMP)可被编程为两种临时形状(S 和 S),并在加热时有序地从 S 恢复到 S,最终恢复到永久形状,从而实现更复杂的刺激-响应运动。我们通过三步固化(包括 4D 打印、UV 后固化和热固化)引入了一种形成具有高强度和断裂韧性的三重形状记忆氰酸酯(TSMCE)树脂的新策略。所得到的 TSMCE 树脂由于形成互穿聚合物网络(IPN)而呈现出两个分离的玻璃化转变温度(Tg)区域,这成功地赋予了聚合物三重形状记忆效应。两个 Tg 随着氰酸酯(CE)预聚物含量的增加而增加;它们的范围分别为 82.7-102.1°C 和 164.4-229.0°C。IPN CE 树脂的断裂伸长率高达 10.9%。此外,短碳纤维(CF)和玻璃纤维(GF)与聚合物加速相分离的协同作用导致了两个分离良好的 Tg 峰,表现出更好的优异的三重形状记忆行为和断裂韧性。结合 IPN 结构和 4D 打印的策略为制备高强度和韧性、多重形状记忆效应和多功能性集成的形状记忆聚合物提供了新的思路。

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