Opt Express. 2023 May 8;31(10):16227-16242. doi: 10.1364/OE.477458.
Low-loss photonic integrated circuits (PICs) are the key elements in future quantum technologies, nonlinear photonics and neural networks. The low-loss photonic circuits technology targeting C-band application is well established across multi-project wafer (MPW) fabs, whereas near-infrared (NIR) PICs suitable for the state-of-the-art single-photon sources are still underdeveloped. Here, we report the labs-scale process optimization and optical characterization of low-loss tunable photonic integrated circuits for single-photon applications. We demonstrate the lowest propagation losses to the date (as low as 0.55 dB/cm at 925 nm wavelength) in single-mode silicon nitride submicron waveguides (220×550 nm). This performance is achieved due to advanced e-beam lithography and inductively coupled plasma reactive ion etching steps which yields waveguides vertical sidewalls with down to 0.85 nm sidewall roughness. These results provide a chip-scale low-loss PIC platform that could be even further improved with high quality SiO cladding, chemical-mechanical polishing and multistep annealing for extra-strict single-photon applications.
低损耗光子集成电路(PIC)是未来量子技术、非线性光子学和神经网络的关键要素。针对 C 波段应用的低损耗光子电路技术已经在多项目晶圆(MPW)工厂中得到很好的建立,而适用于最先进单光子源的近红外(NIR)PIC 仍在开发中。在这里,我们报告了实验室规模的优化和单光子应用的低损耗可调光子集成电路的光学特性。我们展示了迄今为止最低的传播损耗(在 925nm 波长下低至 0.55dB/cm)在单模氮化硅亚微米波导(220×550nm)中。这种性能是通过先进的电子束光刻和感应耦合等离子体反应离子刻蚀工艺实现的,该工艺产生的波导垂直侧壁具有低至 0.85nm 的侧壁粗糙度。这些结果提供了一个芯片级的低损耗 PIC 平台,如果使用高质量的 SiO 包层、化学机械抛光和多步退火进行进一步改进,它甚至可以用于更严格的单光子应用。