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通过温度依赖的射频溅射制备 p 型碲薄膜的电导率、塞贝克系数和晶体生长。

Electrical conductivity, Seebeck coefficient, and crystal growth of p-type tellurium films through temperature dependent RF sputtering.

机构信息

Division of Materials Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea.

Graduate Faculty of Interdisciplinary Research, University of Yamanashi, 4-4-37 Takeda, Kofu, Yamanashi 400-8510, Japan.

出版信息

Nanotechnology. 2023 Jul 3;34(38). doi: 10.1088/1361-6528/acdd0a.

Abstract

Te thin films have recently received considerable attention owing to its superior electrical and thermoelectric properties. During the deposition process, if the temperature of the substrate is raised, high crystallinity and improved electrical properties can be expected. In this study, we used radio frequency sputtering for Te deposition to study the relationship between the deposition temperature, crystal size, and electrical performance. As the deposition temperature is increased from room temperature to 100 °C, we observed an increase in crystal size from the x-ray diffraction patterns and full-width half maximum calculations. With this grain size increment, the Hall mobility and Seebeck coefficient of the Te thin film increased significantly from 16 to 33 cmVsand 50 to 138V K, respectively. This study reveals the potential of a facile fabrication method for enhanced Te thin films using temperature control and highlights the importance of the Te crystal structure in determining the electrical/thermoelectrical properties. These findings are particularly significant for the development of semiconductor material systems for various applications, including thermoelectric devices, CMOS, FET, and solar devices.

摘要

碲薄膜因其优异的电学和热电性能而受到了广泛关注。在沉积过程中,如果提高衬底的温度,可以预期得到高结晶度和改善的电学性能。在这项研究中,我们使用射频磁控溅射法进行碲沉积,以研究沉积温度、晶体尺寸和电性能之间的关系。随着沉积温度从室温升高到 100°C,我们从 X 射线衍射图谱和半高宽计算中观察到晶体尺寸的增加。随着晶粒尺寸的增加,碲薄膜的霍尔迁移率和 Seebeck 系数分别从 16 增加到 33cmVs 和从 50 增加到 138V K。这项研究揭示了通过温度控制来增强碲薄膜的简便制造方法的潜力,并强调了碲晶体结构在确定电学/热电性能方面的重要性。这些发现对于开发各种应用的半导体材料系统,包括热电设备、CMOS、FET 和太阳能设备,具有重要意义。

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