Zhang Qian, Charania Sujay, Rothe Stefan, Koukourakis Nektarios, Neumann Niels, Plettemeier Dirk, Czarske Juergen W
Laboratory of Measurement and Sensor System Technique, Faculty of Electrical and Computer Engineering, TU Dresden, 01069 Dresden, Germany.
Chair of Radio Frequency and Photonics Engineering, Faculty of Electrical and Computer Engineering, TU Dresden, 01069 Dresden, Germany.
Sensors (Basel). 2023 Jul 1;23(13):6076. doi: 10.3390/s23136076.
Following Moore's law, the density of integrated circuits is increasing in all dimensions, for instance, in 3D stacked chip networks. Amongst other electro-optic solutions, multimode optical interconnects on a silicon interposer promise to enable high throughput for modern hardware platforms in a restricted space. Such integrated architectures require confidential communication between multiple chips as a key factor for high-performance infrastructures in the 5G era and beyond. Physical layer security is an approach providing information theoretic security among network participants, exploiting the uniqueness of the data channel. We experimentally project orthogonal and non-orthogonal symbols through 380 μm long multimode on-chip interconnects by wavefront shaping. These interconnects are investigated for their uniqueness by repeating these experiments across multiple channels and samples. We show that the detected speckle patterns resulting from modal crosstalk can be recognized by training a deep neural network, which is used to transform these patterns into a corresponding readable output. The results showcase the feasibility of applying physical layer security to multimode interconnects on silicon interposers for confidential optical 3D chip networks.
遵循摩尔定律，集成电路的密度在各个维度上都在增加，例如在三维堆叠芯片网络中。在其他电光解决方案中，硅中介层上的多模光互连有望在有限空间内为现代硬件平台实现高吞吐量。这种集成架构需要多个芯片之间的保密通信，这是5G及以后高性能基础设施的关键因素。物理层安全是一种在网络参与者之间提供信息理论安全的方法，它利用了数据通道的独特性。我们通过波前整形在380μm长的多模片上互连上实验性地投射正交和非正交符号。通过在多个通道和样本上重复这些实验，研究了这些互连的独特性。我们表明，通过训练深度神经网络可以识别由模态串扰产生的检测到的散斑图案，该网络用于将这些图案转换为相应的可读输出。结果展示了将物理层安全应用于硅中介层上的多模互连以实现保密光三维芯片网络的可行性。
