Biomechanics Group, Department of Mechanical Engineering, Imperial College London, UK.
Biomechanics Group, Department of Mechanical Engineering, Imperial College London, UK; Biomedical Engineering Department, Khalifa University, United Arab Emirates.
Biomater Adv. 2023 Nov;154:213590. doi: 10.1016/j.bioadv.2023.213590. Epub 2023 Aug 14.
Smart implantable electronic medical devices are being developed to deliver healthcare that is more connected, personalised, and precise. Many of these implantables rely on piezoceramics for sensing, communication, energy autonomy, and biological stimulation, but the piezoceramics with the strongest piezoelectric coefficients are almost exclusively lead-based. In this article, we evaluate the electromechanical and biological characteristics of a lead-free alternative, 0.94BiNaTiO-0.06BaTiO (BNT-6BT), manufactured via two synthesis routes: the conventional solid-state method (PIC700) and tape casting (TC-BNT-6BT). The BNT-6BT materials exhibited soft piezoelectric properties, with d piezoelectric coefficients that were inferior to commonly used PZT (PIC700: 116 pC/N; TC-BNT-6BT: 121 pC/N; PZT-5A: 400 pC/N). The material may be viable as a lead-free substitute for soft PZT where moderate performance losses up to 10 dB are tolerable, such as pressure sensing and pulse-echo measurement. No short-term harmful biological effects of BNT-6BT were detected and the material was conducive to the proliferation of MC3T3-E1 murine preosteoblasts. BNT-6BT could therefore be a viable material for electroactive implants and implantable electronics without the need for hermetic sealing.
智能植入式电子医疗设备正在被开发出来,以提供更互联、个性化和精准的医疗服务。许多这些植入物依赖于压电陶瓷来实现传感、通信、能源自主和生物刺激,但具有最强压电系数的压电陶瓷几乎完全是基于铅的。在本文中,我们评估了一种无铅替代品 0.94BiNaTiO-0.06BaTiO(BNT-6BT)的机电和生物特性,该替代品通过两种合成路线制造:传统的固态法(PIC700)和带铸法(TC-BNT-6BT)。BNT-6BT 材料表现出软压电特性,d 压电系数低于常用的 PZT(PIC700:116 pC/N;TC-BNT-6BT:121 pC/N;PZT-5A:400 pC/N)。该材料可能是软 PZT 的一种无铅替代品,在可容忍高达 10 dB 的性能损失的情况下,如压力传感和脉冲回波测量。未检测到 BNT-6BT 的短期有害生物效应,并且该材料有利于 MC3T3-E1 鼠前成骨细胞的增殖。因此,BNT-6BT 可以成为无需密封的有源植入物和植入式电子设备的一种可行材料。