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冷变形及热处理对铜银合金丝性能影响的研究

Study on the Effect of Cold Deformation and Heat Treatment on the Properties of Cu-Ag Alloy Wire.

作者信息

Wu Xuefeng, Jia Hewei, Fan Junling, Cao Jun, Su Chenghao

机构信息

School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.

Chemical and Environmental Engineering, Jiaozuo University, Jiaozuo 454003, China.

出版信息

Micromachines (Basel). 2023 Aug 19;14(8):1635. doi: 10.3390/mi14081635.

DOI:10.3390/mi14081635
PMID:37630171
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10456561/
Abstract

The effects of various drawing parameters and annealing processes on the structure and properties of Cu-Ag wires, containing 1 wt% silver, were investigated using specialized equipment including fine wire-drawing machines, very fine wire-drawing machines, heat treatment equipment, tensile testing machines, microcomputer-controlled electronic universal testers, resistance testers, and scanning electron microscopes. The results revealed that continuous drawing of Cu-1%Ag alloy wires led to elongation of the grains, resulting in a uniform and tightly fibrous microstructure. Moreover, the tensile strength of the alloy wire increased from 670 MPa to 783.9 MPa after a single pass with a deformation of 14%. Subsequently, when the wire was drawn at a speed of 500 m/min, the tensile strength further increased to 820.1 MPa. After annealing the Փ0.08 mm Cu-1% Ag alloy wire, an increase in annealing temperature up to 500 °C resulted in the wire's tensile strength decreasing from 820.1 MPa to 377.5 MPa. Simultaneously, the elongation increased from 1.94% to 15.21%, and the resistivity decreased from 1.931 × 10 Ω·m to 1.723 × 10 Ω·m. Additionally, when annealing was conducted at a rate of 80 m/min, the wire resistivity dropped to 1.635 × 10 Ω·m.

摘要

使用包括细线拉丝机、极细线拉丝机、热处理设备、拉伸试验机、微机控制电子万能试验机、电阻测试仪和扫描电子显微镜在内的专业设备,研究了各种拉拔参数和退火工艺对含1 wt%银的铜银线结构和性能的影响。结果表明,连续拉拔Cu-1%Ag合金线会导致晶粒伸长,从而形成均匀且紧密的纤维状微观结构。此外,合金线在单次通过且变形量为14%后,其拉伸强度从670 MPa增加到783.9 MPa。随后,当线以500 m/min的速度拉拔时,拉伸强度进一步增加到820.1 MPa。对直径0.08 mm的Cu-1%Ag合金线进行退火后,将退火温度提高到500°C会导致线的拉伸强度从820.1 MPa降低到377.5 MPa。同时,伸长率从1.94%增加到15.21%,电阻率从1.931×10Ω·m降低到1.723×10Ω·m。此外,当以80 m/min的速率进行退火时,线的电阻率降至1.635×10Ω·m。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/ff3a388d4792/micromachines-14-01635-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/77c967a0d9e9/micromachines-14-01635-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/6c8a1ed6ffe6/micromachines-14-01635-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/3a0fc34ee9d2/micromachines-14-01635-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/f518d525b317/micromachines-14-01635-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/c889802ba8c8/micromachines-14-01635-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/7c0535667344/micromachines-14-01635-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/e3e2f645ad11/micromachines-14-01635-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/88abe72e0836/micromachines-14-01635-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/e985b4aebb30/micromachines-14-01635-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/ff3a388d4792/micromachines-14-01635-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/77c967a0d9e9/micromachines-14-01635-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/6c8a1ed6ffe6/micromachines-14-01635-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/3a0fc34ee9d2/micromachines-14-01635-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/f518d525b317/micromachines-14-01635-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/c889802ba8c8/micromachines-14-01635-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/7c0535667344/micromachines-14-01635-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/e3e2f645ad11/micromachines-14-01635-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/88abe72e0836/micromachines-14-01635-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/e985b4aebb30/micromachines-14-01635-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bd48/10456561/ff3a388d4792/micromachines-14-01635-g010.jpg

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本文引用的文献

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Research Progress on Bonding Wire for Microelectronic Packaging.微电子封装用键合线的研究进展
Micromachines (Basel). 2023 Feb 11;14(2):432. doi: 10.3390/mi14020432.