Chen Shuang, Wu Changlong, Bo Guowei, Liu Haiyang, Tang Jie, Fu Dingfa, Teng Jie, Jiang Fulin
Hunan Provincial Key Laboratory of Vehicle Power and Transmission System, Hunan Institute of Engineering, Xiangtan 411104, China.
College of Materials Science and Engineering, Hunan University, Changsha 410082, China.
Materials (Basel). 2023 Sep 20;16(18):6292. doi: 10.3390/ma16186292.
SiC particle (SiCp) size has been found to significantly influence the hot workability of particle-reinforced aluminum matrix composites (AMC). In this work, therefore, three types of SiCp/6013 composites with different SiCp sizes (0.7, 5 and 15 μm) were prepared and then subjected to isothermal hot compression tests. In addition, constitutive analysis, processing maps and microstructural characterizations were used to reveal the influence of SiCp size on the hot workability of SiCp/6013 composite. The results showed that the values of hot deformation activation energy Q increased with decreasing SiCp size. Specifically, at lower temperatures (e.g., 350 and 400 °C), the highest peak stress was shown in the AMC with SiCp size of 0.7 μm (AMC-0.7), while in the AMC with SiCp size of 5 μm (AMC-5) at higher temperatures (e.g., 450 and 500 °C). This is because a finer SiCp size would lead to stronger dislocation pinning and grain refinement strengthening effects, and such effects would be weakened at higher temperatures. Further, dynamic softening mechanisms were found to transform from dynamic recovery to dynamic recrystallization with increasing SiCp size, and the dynamic recrystallization occurred more easily at higher temperatures and lower strain rates. Consequently, the instability zones of the composites are all mainly located in the deformation region with lower temperature and higher strain rate, and smaller SiCp results in larger instability zones.
已发现碳化硅颗粒(SiCp)尺寸对颗粒增强铝基复合材料(AMC)的热加工性能有显著影响。因此,在本研究中,制备了三种具有不同SiCp尺寸(0.7、5和15μm)的SiCp/6013复合材料,然后对其进行等温热压缩试验。此外,通过本构分析、加工图和微观结构表征来揭示SiCp尺寸对SiCp/6013复合材料热加工性能的影响。结果表明,热变形激活能Q值随SiCp尺寸减小而增大。具体而言,在较低温度下(例如350和400°C),SiCp尺寸为0.7μm的AMC(AMC-0.7)表现出最高的峰值应力,而在较高温度下(例如450和500°C),SiCp尺寸为5μm的AMC(AMC-5)表现出最高的峰值应力。这是因为更细的SiCp尺寸会导致更强的位错钉扎和晶粒细化强化效果,而这种效果在较高温度下会减弱。此外,发现随着SiCp尺寸的增加,动态软化机制从动态回复转变为动态再结晶,并且动态再结晶在较高温度和较低应变速率下更容易发生。因此,复合材料的失稳区均主要位于较低温度和较高应变速率的变形区域,且较小的SiCp会导致更大的失稳区。