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过渡金属和碱土金属掺杂硫化铜的电子性质:一项密度泛函理论研究

Electronic Properties of Transition and Alkaline Earth Metal Doped CuS: A DFT Study.

作者信息

Oppong-Antwi Louis, Huang Bosi, Hart Judy N

机构信息

School of Materials Science and Engineering, UNSW, Sydney, NSW, 2052, Australia.

出版信息

Chemphyschem. 2023 Dec 1;24(23):e202300417. doi: 10.1002/cphc.202300417. Epub 2023 Oct 4.

Abstract

CuS is a unique semiconductor with potential in optoelectronics. Its unusual electronic structure, including a partially occupied valence band, and complex crystal structure with an S-S bond offer unique opportunities and potential applications. In this work, the use of doping to optimize the properties of CuS for various applications is investigated by density functional theory (DFT) calculations. Among the dopants studied, Ni, Zn, and Mg may be the most practical due to their lower formation energies. Doping with Fe, Ni, or Ca induces significant distortion, which may be beneficial for achieving materials with high surface areas and active states. Significantly, doping alters the conductor-like behavior of CuS, opening a band gap by increasing bond ionicity and reducing the S-S bond covalency. Thus, doping CuS can tune the plasmonic properties and transform it from a conductor to an intrinsic fluorescent semiconductor. Ni and Fe doping give the lowest band gaps (0.35 eV and 0.39 eV, respectively), while Mg doping gives the highest (0.86 eV). Doping with Mg, Ca, and Zn may enhance electron mobility and charge separation. Most dopants increase the anisotropy of electron-to-hole mass ratios, enabling device design that exploits directional-dependence for improved performance.

摘要

硫化铜是一种在光电子学领域具有潜力的独特半导体。其异常的电子结构,包括部分占据的价带,以及具有S-S键的复杂晶体结构,提供了独特的机遇和潜在应用。在这项工作中,通过密度泛函理论(DFT)计算研究了使用掺杂来优化硫化铜用于各种应用的性能。在所研究的掺杂剂中,镍、锌和镁因其较低的形成能可能是最实用的。用铁、镍或钙掺杂会引起显著的畸变,这可能有利于获得具有高表面积和活性状态的材料。值得注意的是,掺杂改变了硫化铜的类导体行为,通过增加键的离子性和降低S-S键的共价性来打开带隙。因此,掺杂硫化铜可以调节等离子体性质并将其从导体转变为固有荧光半导体。镍和铁掺杂产生的带隙最低(分别为0.35 eV和0.39 eV),而镁掺杂产生的带隙最高(0.86 eV)。用镁、钙和锌掺杂可能会提高电子迁移率和电荷分离。大多数掺杂剂会增加电子与空穴质量比的各向异性,从而实现利用方向依赖性来提高性能的器件设计。

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