Chen Cheng, Li Ziyun, Wang Yanlai, Zhang Ze, Ren Chunhua
School of Mechanical Engineering, Tianjin University of Commerce, Tianjin 300134, China.
Materials (Basel). 2023 Oct 6;16(19):6586. doi: 10.3390/ma16196586.
Flexible electronic films need to be applied in different ambient temperatures. The porous substrate of the composite film enhances air permeability. The lifespan of these composite films is significantly affected by variations in temperature and substrate porosity. To explore the impact of temperature and porosity on the performance of composite films, we developed a 3D deformation detection system utilizing the advanced three-dimensional digital image correlation (3D-DIC) method. This system enabled us to observe and analyze the 3D deformation behaviors of porous polydimethylsiloxane (PDMS) flexible composite films when they are subjected to uniaxial stretching at different temperatures. We proposed employing two parameters, namely the strain fluctuation coefficient () and off-plane displacement (), to characterize the 3D deformation of the films. This holistic characterization of deformation through the combined utilization of parameters M and held greater significance for composite films compared to the conventional practice of solely measuring mechanical properties like the elastic modulus. Through experimental analysis, we discovered that as the temperature increased, the value of the film decreased while the value increased for the same stretching distance. Furthermore, the porosity of the composite film depended on the doping mass ratio of PDMS to deionized water during the fabrication process. Specifically, when the ratio was set at 6:1, the composite film exhibited the smallest value and value, and the highest air permeability. Additionally, the 3D deformation behavior remained stable across different temperatures for this specific ratio. Moreover, our findings unveiled a remarkable association between the parameter and the resistance value of the device. These findings provide valuable insights for optimizing the fabrication process of porous PDMS flexible electronic composite films.
柔性电子薄膜需要在不同的环境温度下应用。复合薄膜的多孔基材增强了透气性。这些复合薄膜的寿命受到温度和基材孔隙率变化的显著影响。为了探究温度和孔隙率对复合薄膜性能的影响,我们利用先进的三维数字图像相关(3D-DIC)方法开发了一种三维变形检测系统。该系统使我们能够观察和分析多孔聚二甲基硅氧烷(PDMS)柔性复合薄膜在不同温度下进行单轴拉伸时的三维变形行为。我们提出使用两个参数,即应变波动系数()和离面位移()来表征薄膜的三维变形。与仅测量弹性模量等力学性能的传统做法相比,通过综合利用参数M和 对变形进行这种整体表征对复合薄膜具有更大的意义。通过实验分析,我们发现随着温度升高,在相同拉伸距离下薄膜的 值减小而 值增大。此外,复合薄膜的孔隙率取决于制造过程中PDMS与去离子水的掺杂质量比。具体而言,当该比例设定为6:1时,复合薄膜表现出最小的 值和 值以及最高的透气性。此外,对于该特定比例,三维变形行为在不同温度下保持稳定。而且,我们的研究结果揭示了参数 与器件电阻值之间的显著关联。这些发现为优化多孔PDMS柔性电子复合薄膜的制造工艺提供了有价值的见解。