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金属有机框架的直接电化学合成:铜薄膜和铜基微结构上的Cu(BTC)和Cu(TCPP)

Direct Electrochemical Synthesis of Metal-Organic Frameworks: Cu (BTC) and Cu(TCPP) on Copper Thin films and Copper-Based Microstructures.

作者信息

Araújo-Cordero Ana María, Caddeo Francesco, Mahmoudi Behzad, Bron Michael, Wouter Maijenburg A

机构信息

Center for Innovation Competence SiLi-nano, Martin-Luther-Universität Halle-Wittenberg, Karl-Freiherr-von-Fritsch-Straße 3, 06120, Halle, Germany.

Institut für Chemie, Technische Chemie, Martin-Luther-Universität Halle-Wittenberg, Von-Danckelmann-Platz 4, 06120, Halle, Germany.

出版信息

Chempluschem. 2024 Mar;89(3):e202300378. doi: 10.1002/cplu.202300378. Epub 2023 Dec 15.

DOI:10.1002/cplu.202300378
PMID:37997644
Abstract

Cu thin films and Cu O microstructures were partially converted to the Metal-Organic Frameworks (MOFs) Cu (BTC) or Cu(TCPP) using an electrochemical process with a higher control and at milder conditions compared to the traditional solvothermal MOF synthesis. Initially, either a Cu thin film was sputtered, or different kinds of Cu or Cu O microstructures were electrochemically deposited onto a conductive ITO glass substrate. Then, these Cu thin films or Cu-based microstructures were subsequently coated with a thin layer of either Cu (BTC) or Cu(TCPP) by controlled anodic dissolution of the Cu-based substrate at room temperature and in the presence of the desired organic linker molecules: 1,3,5-benzenetricarboxylic acid (BTC) or photoactive 4,4',4'',4'''-(Porphine-5,10,15,20-tetrayl) tetrakis(benzoic acid) (TCPP) in the electrolyte. An increase in size of the Cu micro cubes with exposed planes [100] of 38,7 % for the Cu O@Cu (BTC) and a 68,9 % increase for the Cu O@Cu(TCPP) was roughly estimated. Finally, XRD, Raman spectroscopy and UV-vis absorption spectroscopy were used to characterize the initial Cu films or Cu-based microstructures, and the obtained core-shell Cu O@Cu(BTC) and Cu O@Cu(TCPP) microstructures.

摘要

与传统的溶剂热金属有机框架(MOF)合成相比,通过电化学过程在更高的可控性和更温和的条件下,将铜薄膜和氧化铜微结构部分转化为金属有机框架(MOF)Cu(BTC)或Cu(TCPP)。最初,要么溅射铜薄膜,要么将不同种类的铜或氧化铜微结构电化学沉积到导电的ITO玻璃基板上。然后,通过在室温下以及在所需的有机连接分子(1,3,5-苯三甲酸(BTC)或光活性的4,4',4'',4'''-(卟啉-5,10,15,20-四基)四(苯甲酸)(TCPP))存在的情况下,对铜基基板进行可控阳极溶解,随后用一层薄薄的Cu(BTC)或Cu(TCPP)覆盖这些铜薄膜或铜基微结构。粗略估计,对于Cu O@Cu(BTC),具有暴露平面[100]的铜微立方体尺寸增加了38.7%,对于Cu O@Cu(TCPP),尺寸增加了68.9%。最后,使用X射线衍射(XRD)、拉曼光谱和紫外可见吸收光谱来表征初始的铜薄膜或铜基微结构,以及获得的核壳结构Cu O@Cu(BTC)和Cu O@Cu(TCPP)微结构。

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