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通过掺杂锰大幅提高柔性硫化铜薄膜的热电功率因数

Largely Enhanced Thermoelectric Power Factor of Flexible CuS Film by Doping Mn.

作者信息

Zuo Xinru, Han Xiaowen, Lu Yiming, Liu Ying, Wang Zixing, Li Jiajia, Cai Kefeng

机构信息

Key Laboratory of Advanced Civil Engineering Materials of Ministry of Education, Shanghai Key Laboratory of Development and Application for Metal-Functional Materials, School of Materials Science & Engineering, Tongji University, Shanghai 201804, China.

出版信息

Materials (Basel). 2023 Nov 14;16(22):7159. doi: 10.3390/ma16227159.

Abstract

Copper-sulfide-based materials have attracted noteworthy attention as thermoelectric materials due to rich elemental reserves, non-toxicity, low thermal conductivity, and adjustable electrical properties. However, research on the flexible thermoelectrics of copper sulfide has not yet been reported. In this work, we developed a facile method to prepare flexible Mn-doped CuS films on nylon membranes. First, nano to submicron powders with nominal compositions of CuMnS (y = 0, 0.01, 0.03, 0.05, 0.07) were synthesized by a hydrothermal method. Then, the powders were vacuum-filtrated on nylon membranes and finally hot-pressed. Phase composition and microstructure analysis revealed that the films contained both CuS and CuS, and the size of the grains was ~20-300 nm. By Mn doping, there was an increase in carrier concentration and mobility, and ultimately, the electrical properties of CuS were improved. Eventually, the CuMnS film showed a maximum power factor of 113.3 μW m K and good flexibility at room temperature. Moreover, an assembled four-leg flexible thermoelectric generator produced a maximum power of 249.48 nW (corresponding power density ~1.23 W m) at a temperature difference of 30.1 K, and had good potential for powering low-power-consumption wearable electronics.

摘要

基于硫化铜的材料因其丰富的元素储量、无毒、低导热性和可调节的电学性能,作为热电材料受到了显著关注。然而,关于硫化铜柔性热电材料的研究尚未见报道。在这项工作中,我们开发了一种简便的方法,在尼龙膜上制备柔性锰掺杂硫化铜薄膜。首先,通过水热法合成了标称组成为CuMnS(y = 0、0.01、0.03、0.05、0.07)的纳米至亚微米粉末。然后,将这些粉末真空过滤到尼龙膜上,最后进行热压。相组成和微观结构分析表明,薄膜中同时含有CuS和Cu₂S,晶粒尺寸约为20 - 300 nm。通过锰掺杂,载流子浓度和迁移率增加,最终改善了硫化铜的电学性能。最终,CuMnS薄膜在室温下显示出113.3 μW m⁻¹ K⁻²的最大功率因子和良好的柔韧性。此外,一个组装的四腿柔性热电发电机在30.1 K的温差下产生了249.48 nW的最大功率(相应的功率密度约为1.23 W m⁻²),并且在为低功耗可穿戴电子产品供电方面具有良好的潜力。

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