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SiCp/Al非共振振动辅助研磨的仿真与实验研究

Simulation and Experimental Study of Non-Resonant Vibration-Assisted Lapping of SiCp/Al.

作者信息

Zhao Huibo, Gu Yan, Xi Yuan, Fu Xingbao, Gao Yinghuan, Wang Jiali, Xie Lue, Liang Guangyu

机构信息

Jilin Provincial Key Laboratory of Micro-Nano and Ultra-Precision Manufacturing, School of Mechatronic Engineering, Changchun University of Technology, Yan'an Ave 2055, Changchun 130012, China.

Jilin Provincial Key Laboratory of International Science and Technology Cooperation for High Performance Manufacturing and Testing, School of Mechatronic Engineering, Changchun University of Technology, Yan'an Ave 2055, Changchun 130012, China.

出版信息

Micromachines (Basel). 2024 Jan 9;15(1):0. doi: 10.3390/mi15010113.

DOI:10.3390/mi15010113
PMID:38258232
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11154578/
Abstract

SiCp/Al is a difficult-to-machine material that makes it easy to produce surface defects during machining, and researchers focus on reducing the surface defects. Vibration-assisted machining technology is considered an effective method to reduce surface defects by changing the trajectory and contact mode of the abrasive. Aiming at the problem of SiCp/Al processing technology, a vibration-assisted lapping device (VLD) is designed, and elliptical motion is synthesized by a set of parallel symmetrical displacement output mechanisms. The working parameters of the device were tested by simulation and experiment, and the lapping performance was verified. Then, the effects of removal characteristics and process parameters on surface roughness and lapping force were analyzed by simulation and experiment. Simulation and experimental results show that frequency and amplitude that are too low or too high are not conducive to the advantages of NVL. The best surface quality was 54 nm, obtained at A = 8 μm and f = 850 Hz.

摘要

碳化硅颗粒增强铝基复合材料（SiCp/Al）是一种难加工材料，在加工过程中容易产生表面缺陷，研究人员致力于减少表面缺陷。振动辅助加工技术被认为是一种通过改变磨粒的轨迹和接触方式来减少表面缺陷的有效方法。针对SiCp/Al加工工艺问题，设计了一种振动辅助研磨装置（VLD），并通过一组平行对称位移输出机构合成椭圆运动。通过仿真和实验对该装置的工作参数进行了测试，并验证了研磨性能。然后，通过仿真和实验分析了去除特性和工艺参数对表面粗糙度和研磨力的影响。仿真和实验结果表明，过低或过高的频率和振幅都不利于振动辅助研磨的优势。在振幅A = 8μm和频率f = 850Hz时获得了最佳表面质量，为54nm。

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