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基于具有不同高度微柱的形状记忆聚合物的可切换粘合剂,用于激光驱动的非接触转移印刷。

Switchable Adhesive Based on Shape Memory Polymer with Micropillars of Different Heights for Laser-Driven Noncontact Transfer Printing.

作者信息

Luo Hongyu, Li Chenglong, Wang Suhao, Zhang Shun, Song Jizhou

机构信息

Department of Engineering Mechanics, Soft Matter Research Center, Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, and State Key Lab of Brain-Machine Intelligence, Zhejiang University, Hangzhou 310027, China.

Nanhu Brain-Computer Interface Institute, Hangzhou 311100, China.

出版信息

ACS Appl Mater Interfaces. 2024 Feb 21;16(7):9443-9452. doi: 10.1021/acsami.3c16282. Epub 2024 Feb 9.

Abstract

Switchable adhesive is essential to develop transfer printing, which is an advanced heterogeneous material integration technique for developing electronic systems. Designing a switchable adhesive with strong adhesion strength that can also be easily eliminated to enable noncontact transfer printing still remains a challenge. Here, we report a simple yet robust design of switchable adhesive based on a thermally responsive shape memory polymer with micropillars of different heights. The adhesive takes advantage of the shape-fixing property of shape memory polymer to provide strong adhesion for a reliable pick-up and the various levels of shape recovery of micropillars under laser heating to eliminate the adhesion for robust printing in a noncontact way. Systematic experimental and numerical studies reveal the adhesion switch mechanism and provide insights into the design of switchable adhesives. This switchable adhesive design provides a good solution to develop laser-driven noncontact transfer printing with the capability of eliminating the influence of receivers on the performance of transfer printing. Demonstrations of transfer printing of silicon wafers, microscale Si platelets, and micro light emitting diode (μ-LED) chips onto various challenging nonadhesive receivers (e.g., sandpaper, stainless steel bead, leaf, or glass) to form desired two-dimensional or three-dimensional layouts illustrate its great potential in deterministic assembly.

摘要

可切换粘合剂对于转印技术的发展至关重要,转印是一种用于开发电子系统的先进异质材料集成技术。设计一种具有强粘附力且易于去除以实现非接触式转印的可切换粘合剂仍然是一个挑战。在此,我们报告了一种基于具有不同高度微柱的热响应形状记忆聚合物的简单而稳健的可切换粘合剂设计。该粘合剂利用形状记忆聚合物的形状固定特性提供强粘附力,以实现可靠拾取,并利用激光加热下微柱的不同程度形状恢复以非接触方式消除粘附力,从而实现稳健打印。系统的实验和数值研究揭示了粘附切换机制,并为可切换粘合剂的设计提供了见解。这种可切换粘合剂设计为开发激光驱动的非接触式转印提供了一个很好的解决方案,能够消除接收体对转印性能的影响。将硅片、微尺度硅片和微发光二极管(μ-LED)芯片转印到各种具有挑战性的非粘性接收体(如砂纸、不锈钢珠、树叶或玻璃)上以形成所需的二维或三维布局的演示,说明了其在确定性组装方面的巨大潜力。

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