Wang Chengjun, Linghu Changhong, Nie Shuang, Li Chenglong, Lei Qianjin, Tao Xiang, Zeng Yinjia, Du Yipu, Zhang Shun, Yu Kaixin, Jin Hao, Chen Weiqiu, Song Jizhou
Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China.
College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China.
Sci Adv. 2020 Jun 17;6(25):eabb2393. doi: 10.1126/sciadv.abb2393. eCollection 2020 Jun.
Transfer printing that enables heterogeneous integration of materials in desired layouts offers unprecedented opportunities for developing high-performance unconventional electronic systems. However, large-area integration of ultrathin and delicate functional micro-objects with high yields in a programmable fashion still remains as a great challenge. Here, we present a simple, cost-effective, yet robust transfer printing technique via a shape-conformal stamp with actively actuated surface microstructures for programmable and scalable transfer printing with high reliability and efficiency. The shape-conformal stamp features the polymeric backing and commercially available adhesive layer with embedded expandable microspheres. Upon external thermal stimuli, the embedded microspheres expand to form surface microstructures and yield weak adhesion for reliable release. Systematic experimental and computational studies reveal the fundamental aspects of the extraordinary adhesion switchability of stamp. Demonstrations of this protocol in deterministic assemblies of diverse challenging inorganic micro-objects illustrate its extraordinary capabilities in transfer printing for developing high-performance flexible inorganic electronics.
转移印刷能够以所需布局实现材料的异质集成，为开发高性能非传统电子系统提供了前所未有的机遇。然而，以可编程方式高产量地大面积集成超薄且易碎的功能微物体仍然是一个巨大的挑战。在此，我们展示了一种简单、经济高效且稳健的转移印刷技术，该技术通过具有主动驱动表面微结构的形状适配印章实现可编程且可扩展的高可靠性和高效率转移印刷。形状适配印章具有聚合物背衬和带有嵌入式可膨胀微球的市售粘合剂层。在外部热刺激下，嵌入式微球膨胀形成表面微结构，并产生弱粘附力以实现可靠释放。系统的实验和计算研究揭示了印章非凡粘附切换能力的基本方面。该方案在各种具有挑战性的无机微物体的确定性组装中的演示，说明了其在转移印刷以开发高性能柔性无机电子产品方面的非凡能力。
