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硅衬底上水/冰界面二维生长行为的动力学公式

Kinetics formulation for Two-Dimensional Growth Behavior of Water/Ice Interface on Si Substrate.

作者信息

Hanawa Yosuke, Zhang Jianliang, Sasmito Agus P, Xu Minghan, Akhtar Saad, Mohit Mohammaderfan, Yoshida Junichi, Sawada Koichi, Sasaki Yuta, Sakuma Atsushi

机构信息

SCREEN Holdings Co., Ltd., Kyoto 615-8194, Japan.

Faculty of Fiber Science and Engineering, Kyoto Institute of Technology, Kyoto 606-8585, Japan.

出版信息

Langmuir. 2024 Feb 27;40(8):4033-4043. doi: 10.1021/acs.langmuir.3c02594. Epub 2024 Feb 14.

DOI:10.1021/acs.langmuir.3c02594
PMID:38356265
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10906482/
Abstract

Sublimation drying is used in the drying process of semiconductor device manufacturing. However, the solidification behavior mechanics of sublimation agents on substrates has not been clarified. Therefore, the properties of solidified films within substrate surfaces can become nonuniform, leading to their collapse. This study aimed to analyze the interface growth behavior during the cooling and solidification of a water/ice system as a basic case and to clarify the dynamic mechanism of the solidification behavior of liquid films on Si substrates. The solidification behavior of a water/ice system on Si substrates was captured on a video at different cooling rates. The recorded video was subjected to a digital image analysis to examine the crystal morphology and quantify the interface growth rate. The least-squares method with kinetic formulas was used to evaluate the feasibility of fitting the temperature variation to the interface growth rate. A visual examination of the morphology of interfacial growth revealed that it can be classified into four morphologies. The proposed kinetic equation describes the experimental results regarding the temperature dependence of the interfacial growth rate. Through image analysis, the interface growth rate of water and ice was quantified, and an evaluation formula was proposed.

摘要

升华干燥用于半导体器件制造的干燥过程。然而，升华剂在基板上的凝固行为机制尚未明确。因此，基板表面固化膜的性能可能变得不均匀，导致其坍塌。本研究旨在分析水/冰系统冷却和凝固过程中的界面生长行为，作为一个基本案例，并阐明液膜在硅基板上凝固行为的动力学机制。在不同冷却速率下，用视频记录了水/冰系统在硅基板上的凝固行为。对记录的视频进行数字图像分析，以检查晶体形态并量化界面生长速率。使用带有动力学公式的最小二乘法来评估将温度变化拟合到界面生长速率的可行性。对界面生长形态的目视检查表明，它可分为四种形态。所提出的动力学方程描述了关于界面生长速率温度依赖性的实验结果。通过图像分析，量化了水和冰的界面生长速率，并提出了一个评估公式。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2bbc/10906482/e5a13b455b6d/la3c02594_0015.jpg
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