Cothard Nicholas F, Stevenson Thomas, Mateo Jennette, Costen Nicholas, Denis Kevin, Perido Joanna, Schrock Ian, Wang Frederick, Glenn Jason
Appl Opt. 2024 Feb 20;63(6):1481-1487. doi: 10.1364/AO.510409.
Future far-infrared astrophysics observatories will require focal plane arrays containing thousands of ultrasensitive, superconducting detectors, each of which require efficient optical coupling to the telescope fore-optics. At longer wavelengths, many approaches have been developed, including feedhorn arrays and macroscopic arrays of lenslets. However, with wavelengths as short as 25 µm, optical coupling in the far infrared remains challenging. In this paper, we present an approach to fabricate far-infrared monolithic silicon microlens arrays using grayscale lithography and deep reactive ion etching. The fabricated microlens arrays presented here are designed for two different wavebands: 25-40 µm and 135-240 µm. The microlens arrays have sags as deep as 150 µm, are hexagonally packed with a pixel pitch of 900 µm, and have an overall size as large as 80 by 15 mm. We compare an as-fabricated lens profile to the design profile and calculate that the fabricated lenses would achieve 84% encircled power for the designed detector, which is only 3% less than the designed performance. We also present methods developed for antireflection coating microlens arrays and for a silicon-to-silicon die bonding process to hybridize microlens arrays with detector arrays.
未来的远红外天体物理观测站将需要包含数千个超灵敏超导探测器的焦平面阵列,每个探测器都需要与望远镜前光学系统进行高效的光耦合。在较长波长下,已经开发了许多方法,包括馈源喇叭阵列和微透镜宏观阵列。然而,在波长低至25微米的情况下,远红外光耦合仍然具有挑战性。在本文中,我们提出了一种使用灰度光刻和深反应离子刻蚀制造远红外单片硅微透镜阵列的方法。这里展示的制造出的微透镜阵列是为两个不同波段设计的:25 - 40微米和135 - 240微米。这些微透镜阵列的凹陷深度达150微米,呈六边形排列,像素间距为900微米,整体尺寸大至80×15毫米。我们将制造出的透镜轮廓与设计轮廓进行比较,并计算出制造出的透镜对于设计的探测器将实现84%的环围能量,这仅比设计性能低3%。我们还展示了为微透镜阵列抗反射涂层以及为将微透镜阵列与探测器阵列杂交的硅 - 硅芯片键合工艺所开发的方法。