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电子束焊接Zr-Sn-Nb接头的微观结构研究与性能评估

Study of Microstructure and Performance Evaluation of Zr-Sn-Nb Joints by Electron Beam Welding.

作者信息

Zhao Yanli, Zhang Anrui, Yue Huifang, Wang Houqin, Xin Yong, Zhou Yi

机构信息

Science and Technology on Reactor System Design Technology Laboratory, Nuclear Power Institute of China, Chengdu 610213, China.

National Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001, China.

出版信息

Materials (Basel). 2024 Feb 20;17(5):980. doi: 10.3390/ma17050980.

Abstract

In this work, Zr-Sn-Nb alloy was joined by electron beam welding (EBW). A defect-free Zr-Sn-Nb joint with sound appearance was obtained. The grains in the weld zone (WZ) and heat-affected zone (HAZ) are significantly coarsened. The columnar grains with a maximum grain size of 0.5 mm are distributed in the upper region of the WZ, while the equiaxed grains are almost located in the bottom region of the WZ. The WZ is mainly composed of the dominant α-Zr, α'-Zr and a few β phases. The grain orientation of WZ and HAZ is uniform, indicating that no obvious preferred orientation existed. Coarse grains and fine acicular α' phases increase the strength of the joint, but reduce the plasticity and toughness of the joint. The tensile strengths of the joints at room temperature (RT) and 375 °C were 438 MPa and 313 MPa, respectively. The RT impact energy of the joint is 18.5 J, which is only 58.3% of the BM. The high purity of the EBW process and unsignificant grain orientation minimizes damage to the corrosion resistance of Zr-Sn-Nb alloy joints. The corrosion weight gain of the joint specimen and the BM specimen were 12.91 mg/dm and 12.64 mg/dm, respectively, and the thicknesses of the cross-section corrosion layer were 12-15 μm and 9-12 μm, respectively.

摘要

在本工作中,采用电子束焊接(EBW)连接Zr-Sn-Nb合金。获得了外观良好、无缺陷的Zr-Sn-Nb接头。焊缝区(WZ)和热影响区(HAZ)的晶粒显著粗化。最大晶粒尺寸为0.5 mm的柱状晶粒分布在WZ的上部区域,而等轴晶粒几乎位于WZ的底部区域。WZ主要由占主导地位的α-Zr、α'-Zr和少量β相组成。WZ和HAZ的晶粒取向均匀,表明不存在明显的择优取向。粗大晶粒和细小针状α'相提高了接头的强度,但降低了接头的塑性和韧性。接头在室温(RT)和375 °C时的抗拉强度分别为438 MPa和313 MPa。接头的室温冲击能量为18.5 J,仅为母材(BM)的58.3%。电子束焊接工艺的高纯度和不显著的晶粒取向对接头的耐腐蚀性损害最小。接头试样和BM试样的腐蚀增重分别为12.91 mg/dm²和12.64 mg/dm²,横截面腐蚀层厚度分别为12 - 15 μm和9 - 12 μm。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/64e0/10933976/b6facdd49b18/materials-17-00980-g001.jpg

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