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CMT 增材制造过程中 Mg-Gd-Y-Zn-Zr 合金温度场与应力场的模拟研究

Simulation Study on Temperature and Stress Fields in Mg-Gd-Y-Zn-Zr Alloy during CMT Additive Manufacturing Process.

作者信息

Zhao Mingkun, Zhao Zhanyong, Du Wenbo, Bai Peikang, Huang Zhiquan

机构信息

School of Materials Science and Engineering, North University of China, Taiyuan 030051, China.

National Key Laboratory for Remanufacturing, Academy of Army Armored Forces, Beijing 100072, China.

出版信息

Materials (Basel). 2024 Mar 5;17(5):1199. doi: 10.3390/ma17051199.

Abstract

A new heat source combination, consisting of a uniform body heat source and a tilted double ellipsoidal heat source, has been developed for cold metal transfer (CMT) wire-arc additive manufacturing of Mg-Gd-Y-Zn-Zr alloy. Simulations were conducted to analyze the temperature field and stress distribution during the process. The optimal combination of feeding speed and welding speed was found to be 8 m/min and 8 mm/s, respectively, resulting in the lowest thermal accumulation and residual stress. Z-axis residual stress was identified as the main component of residual stress. Electron Backscatter Diffraction (EBSD) testing showed weak texture strength, and Kernel Average Misorientation (KAM) analysis revealed that the 1st layer had the highest residual stress, while the 11th layer had higher residual stress than the 6th layer. Microhardness in the 1st, 11th, and 6th layers varies due to residual stress impacts on dislocation density. Higher residual stress increases dislocation density, raising microhardness in components. The experimental results were highly consistent with the simulated results.

摘要

一种由均匀体热源和倾斜双椭球体热源组成的新型热源组合已被开发出来,用于Mg-Gd-Y-Zn-Zr合金的冷金属过渡(CMT)电弧增材制造。进行了模拟以分析该过程中的温度场和应力分布。发现送丝速度和焊接速度的最佳组合分别为8 m/min和8 mm/s,从而产生最低的热积累和残余应力。Z轴残余应力被确定为残余应力的主要组成部分。电子背散射衍射(EBSD)测试显示织构强度较弱,核平均取向差(KAM)分析表明,第一层的残余应力最高,而第十一层的残余应力高于第六层。由于残余应力对位错密度的影响,第一层、第十一层和第六层的显微硬度有所不同。较高的残余应力会增加位错密度,从而提高部件的显微硬度。实验结果与模拟结果高度一致。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f27b/10934179/1d55e5d8e792/materials-17-01199-g001.jpg

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