Kim Chan Soo, Jang Junho, Im Hyeon-Gyun, Yoon Seogyoung, Kang Dong Jun
Insulation Materials Research Center, Electrical Materials Research Division, Korea Electrotechnology Research Institute (KERI), Changwon-si, 51543, Republic of Korea.
School of Materials Science and Engineering, Pusan National University, Busan, 46241, Republic of Korea.
Heliyon. 2024 Mar 4;10(5):e27580. doi: 10.1016/j.heliyon.2024.e27580. eCollection 2024 Mar 15.
Although epoxy-based composites that consist of inorganic fillers and matrixes are widely used in "conventional" electronic packaging applications due to their excellent insulation and robust properties, they limit their uses in "advanced electronic packaging" which requires enhanced thermal conductivity. However, conventional thermal curing methods for fabrication of epoxy-based composites do not fulfill sufficient thermal conductivity. Herein, we apply photo-induced curing strategy for fabricating alumina-incorporated epoxy-siloxane composites that consist of sol-gel derived siloxane matrix and bimodal sized alumina particles as a thermally conductive filler. We investigate how curing mechanism (thermal- or UV-curing) and varying the ratios of the alumina particles of two different sizes affect the various physical properties. It is found that photo-curing process makes greatly enhanced thermal conductivity, low thermal expansion, and high mechanical robustness compared to thermally-cured composites. As the results, we can achieve significantly enhanced thermal conductivity (>11 W/m K) with high thermal stability and mechanical robustness.
尽管由无机填料和基体组成的环氧基复合材料因其优异的绝缘性和坚固性能而广泛应用于“传统”电子封装应用中，但它们在需要提高热导率的“先进电子封装”中的应用受到限制。然而，用于制造环氧基复合材料的传统热固化方法无法实现足够的热导率。在此，我们应用光诱导固化策略来制造掺入氧化铝的环氧-硅氧烷复合材料，该复合材料由溶胶-凝胶衍生的硅氧烷基体和双峰尺寸的氧化铝颗粒作为导热填料组成。我们研究了固化机制（热固化或紫外光固化）以及改变两种不同尺寸氧化铝颗粒的比例如何影响各种物理性能。结果发现，与热固化复合材料相比，光固化过程使热导率大大提高、热膨胀率降低且机械强度更高。结果，我们能够实现显著提高的热导率（>11 W/m·K），同时具有高热稳定性和机械强度。
