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用于两终端氧化物基器件的多刺激原位透射电子显微镜

Multi-Stimuli Operando Transmission Electron Microscopy for Two-Terminal Oxide-Based Devices.

作者信息

Recalde-Benitez Oscar, Pivak Yevheniy, Winkler Robert, Jiang Tianshu, Adabifiroozjaei Esmaeil, Perez-Garza H Hugo, Molina-Luna Leopoldo

机构信息

Advanced Electron Microscopy Division, Institute of Materials Science, Department of Materials and Geosciences, Technische Universität Darmstadt, Peter-Grünber-strasse 2, Darmstadt 64287, Germany.

DENSsolutions BV, Informaticalaan 12, Delft 2628 ZD, The Netherlands.

出版信息

Microsc Microanal. 2024 Apr 29;30(2):200-207. doi: 10.1093/mam/ozae023.

Abstract

The integration of microelectromechanical systems (MEMS)-based chips for in situ transmission electron microscopy (TEM) has emerged as a highly promising technique in the study of nanoelectronic devices within their operational parameters. This innovative approach facilitates the comprehensive exploration of electrical properties resulting from the simultaneous exposure of these devices to a diverse range of stimuli. However, the control of each individual stimulus within the confined environment of an electron microscope is challenging. In this study, we present novel findings on the effect of a multi-stimuli application on the electrical performance of TEM lamella devices. To approximate the leakage current measurements of macroscale electronic devices in TEM lamellae, we have developed a postfocused ion beam (FIB) healing technique. This technique combines dedicated MEMS-based chips and in situ TEM gas cells, enabling biasing experiments under environmental conditions. Notably, our observations reveal a reoxidation process that leads to a decrease in leakage current for SrTiO3-based memristors and BaSrTiO3-based tunable capacitor devices following ion and electron bombardment in oxygen-rich environments. These findings represent a significant step toward the realization of multi-stimuli TEM experiments on metal-insulator-metal devices, offering the potential for further exploration and a deeper understanding of their intricate behavior.

摘要

用于原位透射电子显微镜(TEM)的基于微机电系统(MEMS)芯片的集成,已成为在纳米电子器件工作参数范围内进行研究的一项极具前景的技术。这种创新方法有助于全面探索这些器件在同时受到多种刺激时产生的电学性质。然而,在电子显微镜的有限环境中控制每一种单独的刺激具有挑战性。在本研究中,我们展示了关于多刺激应用对TEM薄片器件电学性能影响的新发现。为了近似宏观电子器件在TEM薄片中的漏电流测量,我们开发了一种后聚焦离子束(FIB)修复技术。该技术结合了基于MEMS的专用芯片和原位TEM气室,能够在环境条件下进行偏置实验。值得注意的是,我们的观察结果揭示了一个再氧化过程,该过程导致基于SrTiO3的忆阻器和基于BaSrTiO3的可调电容器器件在富氧环境中受到离子和电子轰击后漏电流降低。这些发现代表了在金属 - 绝缘体 - 金属器件上实现多刺激TEM实验的重要一步,为进一步探索和深入理解其复杂行为提供了潜力。

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