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Bi-Sn（x = 0.1至0.9）熔融合金的热力学评估及部分Bi-Sn焊料合金的微观结构表征

Thermodynamic Assessment of Molten Bi-Sn (x = 0.1 to 0.9) Alloys and Microstructural Characterization of Some Bi-Sn Solder Alloys.

作者信息

Niculescu Florentina, Pencea Ion, Iacob Gheorghe, Ghiţă Mihai, Stănescu Mariana-Mirela, Petrescu Mircea-Ionuţ, Niculescu Emanuel-Laurenţiu, Buţu Mihai, Stăncel Constantin-Domenic, Şerban Nicolae, Şolea Roxana-Marina, Ilie Andrei-Alexandru

机构信息

Faculty of Materials Science and Engineering, National University of Science and Technology Politehnica Bucharest, 313 Splaiul Independentei, J Building, 060042 Bucharest, Romania.

National R&D Institute for Non-Ferrous and Rare Metals-IMNR, 102 Biruintei, 077145 Pantelimon, Romania.

出版信息

Materials (Basel). 2024 Mar 29;17(7):1579. doi: 10.3390/ma17071579.

DOI:10.3390/ma17071579
PMID:38612093
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11012656/
Abstract

Properties such as lower melting temperature, good tensile strength, good reliability, and well creep resistance, together with low production cost, make the system Bi-Sn an ideal candidate for fine soldering in applications such as reballing or reflow. The first objective of the work was to determine the thermodynamic quantities of Bi and Sn using the electromotive force measurement method in an electrolytic cell (Gibbs' enthalpies of the mixture, integral molar entropies, and the integral molar excess entropies were determined) at temperatures of 600 K and 903 K. The second objective addressed is the comprehensive characterization of three alloy compositions that were selected and elaborated, namely Bi25Sn75, Bi50Sn50, and Bi75Sn25, and morphological and structural investigations were carried out on them. Optical microscopy and SEM-EDS characterization revealed significant changes in the structure of the elaborated alloys, with all phases being uniformly distributed in the Bi50Sn50 and Bi75Sn25 alloys. These observations were confirmed by XRD and EDP-XRFS analyses. Diffractometric analysis reveals the prevalence of metallic Bi and traces of Sn, the formation of the SnBi, SnBi compounds, and SnO and SnO phases.

摘要

诸如较低的熔化温度、良好的拉伸强度、良好的可靠性以及出色的抗蠕变性等特性，再加上较低的生产成本，使得Bi-Sn体系成为倒装芯片或回流焊等应用中精细焊接的理想选择。这项工作的首要目标是在600K和903K的温度下，采用电解池中的电动势测量方法来确定Bi和Sn的热力学量（确定混合物的吉布斯焓、积分摩尔熵和积分摩尔超额熵）。第二个目标是对所选并制备的三种合金成分Bi25Sn75、Bi50Sn50和Bi75Sn25进行全面表征，并对它们进行形态和结构研究。光学显微镜和SEM-EDS表征揭示了制备合金结构的显著变化，在Bi50Sn50和Bi75Sn25合金中所有相均均匀分布。这些观察结果通过XRD和EDP-XRFS分析得到证实。衍射分析揭示了金属Bi的普遍性和Sn的痕迹，SnBi、SnBi化合物以及SnO和SnO相的形成。

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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/07da/11012656/07001c815212/materials-17-01579-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/07da/11012656/938f12928ac4/materials-17-01579-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/07da/11012656/289b2a8077d4/materials-17-01579-g010.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/07da/11012656/41780ff97840/materials-17-01579-g014.jpg

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本文引用的文献

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2
Thermophysical Measurements in Liquid Alloys and Phase Diagram Studies.液态合金的热物理测量与相图研究
Materials (Basel). 2019 Dec 2;12(23):3999. doi: 10.3390/ma12233999.
3
Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints.锡铋焊点的界面反应与力学性能
Materials (Basel). 2017 Aug 9;10(8):920. doi: 10.3390/ma10080920.