Moberg L E, Odén A
Acta Odontol Scand. 1985 Aug;43(4):205-13. doi: 10.3109/00016358509046500.
Three types of amalgams, one conventional and two with a high copper content, were stored in phosphate-buffered 0.9% NaCl solution, at pH 6, for 35 weeks. Every 7 weeks the solutions were changed and analyzed with regard to Cu, Zn, Sn, Hg, and Ag. In one of the amalgam combinations, the conventional amalgam and one of the copper-rich amalgams in an area ratio of 2:1, contact between the amalgams clearly increased the amounts of Cu, Hg, and Ag released the first 14 weeks compared with when immersed in separate solutions. With the reversed area relation, Cu, Hg, and Ag decreased when they were in contact. The conventional amalgam in contact with the other copper-rich amalgam, in an area ratio of 2:1, reduced the amount of Cu but increased the Zn released. Polishing initially decreased the amounts of Cu and Zn released compared with the unpolished amalgams.
三种汞合金,一种是传统汞合金,另外两种是高铜汞合金,被储存在pH值为6的磷酸盐缓冲0.9%氯化钠溶液中35周。每7周更换一次溶液,并对铜、锌、锡、汞和银进行分析。在一种汞合金组合中,传统汞合金与其中一种富铜汞合金的面积比为2:1,与分别浸泡在溶液中相比,两种汞合金之间的接触在最初14周明显增加了铜、汞和银的释放量。当面积比例相反时,铜、汞和银在接触时会减少。传统汞合金与另一种富铜汞合金以2:1的面积比接触时,铜的释放量减少,但锌的释放量增加。与未打磨的汞合金相比,打磨最初减少了铜和锌的释放量。