Miao Mulin, Yin Jianan, Mao Zhengyi, Chen Yuhan, Lu Jian
CityU-Shenzhen Futian Research Institute, Shenzhen, 518045, China.
Hong Kong Branch of National Precious Metals Material Engineering Research Center, City University of Hong Kong, Hong Kong, 999077, China.
Small. 2024 Aug;20(35):e2401742. doi: 10.1002/smll.202401742. Epub 2024 May 9.
There is a growing demand for thermal management materials in electronic fields. Aerogels have attracted interest due to their extremely low density and extraordinary thermal insulation properties. However, the application of aerogels is limited by high production costs and the requirement that aerogel structures not be load-bearing. In this study, mullite-reinforced SiC-based aerogel composite (MR-SiC AC) is prepared through 3D printing combined with in situ growth of SiC nanowires in post processing. The fabricated MR-SiC AC not only has ultra-low thermal conductivity (0.021 W K m) and high porosity (90.0%), but also a high Young's modulus (24.4 MPa) and high compressive strength (1.65 MPa), both exceeding the measurements of existing resilient aerogels by an order of magnitude. These properties make MR-SiC AC an ideal solution for the precision thermal management of lightweight structures having complex geometry for functional devices.
电子领域对热管理材料的需求日益增长。气凝胶因其极低的密度和卓越的隔热性能而备受关注。然而,气凝胶的应用受到高生产成本以及气凝胶结构不能承重这一要求的限制。在本研究中,通过3D打印结合后处理中原位生长SiC纳米线制备了莫来石增强的SiC基气凝胶复合材料(MR-SiC AC)。所制备的MR-SiC AC不仅具有超低的热导率(0.021 W K⁻¹ m⁻¹)和高孔隙率(90.0%),还具有高杨氏模量(24.4 MPa)和高抗压强度(1.65 MPa),两者均比现有弹性气凝胶的测量值高出一个数量级。这些特性使MR-SiC AC成为具有复杂几何形状的功能器件轻质结构精密热管理的理想解决方案。