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用于监测蓝宝石切片过程中金刚石线锯切割能力演变的线弓原位测量

Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire.

作者信息

Yang Zixing, Huang Hui, Liao Xinjiang, Lai Zhiyuan, Xu Zhiteng, Zhao Yanjun

机构信息

Institute of Manufacturing Engineering, Huaqiao University, Xiamen 361021, China.

College of Mechanical Engineering and Automation, Huaqiao University, Xiamen 361021, China.

出版信息

Materials (Basel). 2024 May 2;17(9):2134. doi: 10.3390/ma17092134.

DOI:10.3390/ma17092134
PMID:38730940
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11084698/
Abstract

Electroplated diamond wire sawing is widely used as a processing method to cut hard and brittle difficult-to-machine materials. Currently, obtaining the sawing capability of diamond wire saw through the wire bow is still difficult. In this paper, a method for calculating the sawing capability of diamond wire saw in real-time based on the wire bow is proposed. The influence of the renewed length per round trip, crystal orientation of sapphire, wire speed, and feed rate on the wire sawing capability has been revealed via slicing experiments. The results indicate that renewing the diamond wire saw, and reducing the wire speed and feed rate can delay the reduction in sawing capability. Furthermore, controlling the value of renewed length per round trip can make the diamond wire saw enter a stable cutting state, in which the capability of the wire saw no longer decreases. The sawing capability of diamond wire saw cutting in the A-plane of the sapphire is smaller than that of the C-plane, and a suitable feed rate or wire speed within the range of sawing parameters studied in this study can avoid a rapid decrease in the sawing capability of the wire saw during the cutting process. The knowledge obtained in this study provides a theoretical basis for monitoring the performance of the wire saw, and guidance for the wire cutting process in semiconductor manufacturing. In the future, it may even be possible to provide real-time performance parameters of diamond wire saw for the digital twin model of wire sawing.

摘要

电镀金刚石线锯作为一种切割硬脆难加工材料的加工方法被广泛应用。目前,通过线弓获取金刚石线锯的锯切能力仍然困难。本文提出了一种基于线弓实时计算金刚石线锯锯切能力的方法。通过切片实验揭示了每往返一次的更新长度、蓝宝石的晶体取向、线速度和进给速度对线锯切割能力的影响。结果表明,更新金刚石线锯、降低线速度和进给速度可以延缓锯切能力的下降。此外,控制每往返一次的更新长度值可以使金刚石线锯进入稳定切割状态,在此状态下线锯的能力不再下降。在蓝宝石A面进行金刚石线锯切割的锯切能力小于在C面的锯切能力,并且在本研究中所研究的锯切参数范围内,合适的进给速度或线速度可以避免线锯在切割过程中锯切能力的快速下降。本研究获得的知识为监测线锯性能提供了理论依据,并为半导体制造中的线切割工艺提供了指导。未来,甚至有可能为线锯切割的数字孪生模型提供金刚石线锯的实时性能参数。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/d558293f6f1c/materials-17-02134-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/84a7467d7028/materials-17-02134-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/3ee544544a76/materials-17-02134-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/5da8da7a9c6a/materials-17-02134-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/d5089e76a9c4/materials-17-02134-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/67dc4e81c9e6/materials-17-02134-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/6b207638a306/materials-17-02134-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/63c82c95356d/materials-17-02134-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/d2dfb2dd9130/materials-17-02134-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/d558293f6f1c/materials-17-02134-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/84a7467d7028/materials-17-02134-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/3ee544544a76/materials-17-02134-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/5da8da7a9c6a/materials-17-02134-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/d5089e76a9c4/materials-17-02134-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/67dc4e81c9e6/materials-17-02134-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/6b207638a306/materials-17-02134-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/63c82c95356d/materials-17-02134-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/d2dfb2dd9130/materials-17-02134-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6519/11084698/d558293f6f1c/materials-17-02134-g009.jpg

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Micromachines (Basel). 2023 May 6;14(5):1004. doi: 10.3390/mi14051004.
3
Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface.线锯磨损对切削力及硅片表面影响的实验研究
Materials (Basel). 2023 May 9;16(10):3619. doi: 10.3390/ma16103619.
4
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