锑含量对共晶锡铅焊料微观结构及力学性能的影响

Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder.

作者信息

Zhao Xiuchen, Chang Jiahui, Wu Xuefeng, Ye Zi-Ting, Chen Weiwei, Xie Xiaochen

机构信息

School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China.

School of Integrated Circuit Science and Engineering, Beihang University, Beijing 100191, China.

出版信息

Materials (Basel). 2024 May 9;17(10):2233. doi: 10.3390/ma17102233.

DOI:10.3390/ma17102233

PMID:38793300

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11122834/

Abstract

SnPb solder was widely used in electronic packaging for aerospace devices due to its high reliability. However, its creep resistance is poor and can be improved by adding alloying elements. The effects of Sb content on the microstructure, tensile, and creep properties of eutectic SnPb solder were investigated. Sb addition effectively improved the mechanical properties of the SnPb solder. When Sb content exceeds 1.7 wt.%, SbSn intermetallic compounds (IMCs) occurred. And increasing the Sb content increased the tensile strength. Furthermore, Sb addition decreased the steady-state creep rate and increased the stress exponent , suggesting that the creep resistance had been enhanced, which may be attributed to the hindrance of dislocation movement by SbSn IMCs, as well as the reduction in phase boundaries, which consequently reduced grain boundary sliding.

摘要

由于其高可靠性，SnPb焊料在航空航天设备的电子封装中被广泛使用。然而，其抗蠕变性较差，可以通过添加合金元素来改善。研究了Sb含量对共晶SnPb焊料的微观结构、拉伸性能和蠕变性能的影响。添加Sb有效地改善了SnPb焊料的机械性能。当Sb含量超过1.7 wt.%时，会出现SbSn金属间化合物（IMC）。并且增加Sb含量会提高拉伸强度。此外，添加Sb降低了稳态蠕变速率并增加了应力指数，表明抗蠕变性得到了增强，这可能归因于SbSn IMC对位错运动的阻碍，以及相界的减少，从而减少了晶界滑动。