Department of Chemical Engineering and Materials Science, Grad. Sch. of Engineering, University of Hyogo.
J Oleo Sci. 2024;73(6):887-894. doi: 10.5650/jos.ess24006.
Bicellar mixtures containing diacetylene molecules, such as diynoic acids, can be used as parent materials for functional membranes. A bicellar mixture consisting of a diynoic acid-10,12-tricosadiynoic acid (TCDA)-, a phospholipid-1,2-dimyristoyl-sn-glycero-3-phosphocholine (DMPC)-, and a detergent-3-[(3-cholamidopropyl) dimethylammonio]-2-hydroxypropanesulfonate (CHAPSO)-was evaluated for its morphology and packing of TCDA molecules in its bicellar mixture. A TCDA/DMPC vesicle was prepared at different molar ratios, TCDA/DMPC = 2/8, 5/5, and 8/2; a TCDA/DMPC/CHAPSO bicellar mixture was prepared by mixing a CHAPSO solution with a TCDA/DMPC vesicle solution as a detergent at different composition ratios, x = [TCDA/DMPC]/([TCDA/DMPC]+[CHAPSO]), of 1.0, 0.70, 0.50, and 0.30. A DMPC molecule formed a bilayer membrane structure and was used to suppress its precipitation. The packing density of the TCDA/DMPC/CHAPSO bicellar mixtures was increased by mixing a CHAPSO molecule in x = 1.0 to 0.70 or 0.50. A TEM image of a TCDA/DMPC/CHAPSO bicellar mixture showed many discoidal assemblies at x = 0.5 of TCDA/DMPC = 5/5. Polymerization of the TCDA molecules in the bicellar mixture by UV light suggested an ordered arrangement of TCDA. Polymerization at x = 0.70 and 0.50 correlated with improved packing density.
双分子层混合物中包含二炔分子,如二炔酸,可以用作功能膜的母体材料。一种由二炔酸-10,12-二十二烷二炔酸(TCDA)、磷脂-1,2-二肉豆蔻酰-sn-甘油-3-磷酸胆碱(DMPC)和去污剂-3-[(3-胆酰胺丙基)二甲氨基]-2-羟基丙磺酸钠(CHAPSO)组成的双分子层混合物,用于评估其形态和 TCDA 分子在双分子层混合物中的组装。通过不同的摩尔比,TCDA/DMPC = 2/8、5/5 和 8/2,制备了 TCDA/DMPC 囊泡;通过将 CHAPSO 溶液与 TCDA/DMPC 囊泡溶液混合作为不同组成比的去污剂,x = [TCDA/DMPC]/([TCDA/DMPC]+[CHAPSO]),制备了 TCDA/DMPC/CHAPSO 双分子层混合物,x = 1.0、0.70、0.50 和 0.30。DMPC 分子形成双层膜结构,用于抑制其沉淀。通过在 x = 1.0 到 0.70 或 0.50 混合 CHAPSO 分子,增加了 TCDA/DMPC/CHAPSO 双分子层混合物的组装密度。TCDA/DMPC/CHAPSO 双分子层混合物的 TEM 图像显示,在 TCDA/DMPC = 5/5 的 x = 0.5 处有许多盘状组装体。双分子层混合物中的 TCDA 分子通过紫外光聚合表明 TCDA 排列有序。在 x = 0.70 和 0.50 处的聚合与提高的组装密度相关。