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通过调控界面铜 - 氧键强度改变一氧化碳电还原生成碳或含碳产物的路径。

Altering the CO Electroreduction Pathways Towards C or C Products via Engineering the Strength of Interfacial Cu-O Bond.

作者信息

Zhang Yu, Li Yicheng, Gao Nana, Delmo Ernest Pahuyo, Hou Guoyu, Luo Ali, Wang Dongyang, Chen Ke, Antonietti Markus, Liu Tianxi, Tian Zhihong

机构信息

School of Mechanical and Power Engineering, East China University of Science and Technology, 130 Meilong Road, 200237, Shanghai, China.

Engineering Research Center for Nanomaterials, Henan University, 475004, Kaifeng, P. R. China.

出版信息

Angew Chem Int Ed Engl. 2024 Sep 2;63(36):e202404676. doi: 10.1002/anie.202404676. Epub 2024 Aug 1.

Abstract

Copper (Cu)-based catalysts have established their unique capability for yielding wide value-added products from CO. Herein, we demonstrate that the pathways of the electrocatalytic CO reduction reaction (CORR) can be rationally altered toward C or C products by simply optimizing the coordination of Cu with O-containing organic species (squaric acid (HCO) and cyclohexanehexaone (CO)). It is revealed that the strength of Cu-O bonds can significantly affect the morphologies and electronic structures of derived Cu catalysts, resulting in the distinct behaviors during CORR. Specifically, the CO-Cu catalysts made up from organized nanodomains shows a dominant C pathway with a total Faradaic efficiency (FE) of 63.7 % at -0.6 V (versus reversible hydrogen electrode, RHE). In comparison, the CO-Cu with an about perfect crystalline structure results in uniformly dispersed Cu-atoms, showing a notable FE of 65.8 % for C products with enhanced capability of C-C coupling. The latter system also shows stable operation over at least 10 h with a high current density of 205.1 mA cm at -1.0 V, i.e., is already at the boarder of practical relevance. This study sheds light on the rational design of Cu-based catalysts for directing the CORR reaction pathway.

摘要

铜(Cu)基催化剂已展现出其从CO生成多种高附加值产物的独特能力。在此,我们证明,通过简单优化Cu与含O有机物种(方酸(HCO)和环己烷六酮(CO))的配位,电催化CO还原反应(CORR)的路径可合理地转向生成C或C产物。结果表明,Cu - O键的强度可显著影响衍生Cu催化剂的形貌和电子结构,从而导致CORR过程中出现不同的行为。具体而言,由有序纳米域组成的CO - Cu催化剂显示出占主导的C路径,在-0.6 V(相对于可逆氢电极,RHE)下总法拉第效率(FE)为63.7%。相比之下,具有近乎完美晶体结构的CO - Cu会导致Cu原子均匀分散,对于具有增强C - C偶联能力的C产物显示出65.8%的显著FE。后一种体系在-1.0 V下还能以205.1 mA cm的高电流密度稳定运行至少10 h,即已接近实际应用的边界。本研究为指导CORR反应路径的Cu基催化剂的合理设计提供了思路。

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