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用于柔性电子热管理的高导热超对齐氮化硼纳米管薄膜

Highly Thermally Conductive Super-Aligned Boron Nitride Nanotube Films for Flexible Electronics Thermal Management.

作者信息

Yue Yue, Yang Xiaoran, Yang Kai, Li Kangyong, Liu Zexin, Wang Fanfan, Zhang Rong, Huang Jian, Wang Zhiqiang, Zhang Lifu, Xin Guoqing

机构信息

Wuhan National High Magnetic Field Center & School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.

School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.

出版信息

ACS Appl Mater Interfaces. 2024 Jul 3;16(26):33971-33980. doi: 10.1021/acsami.4c05971. Epub 2024 Jun 19.

Abstract

Flexible electronics toward high integration, miniaturization, and multifunctionality, leading to a dramatic increase in power density. However, the low thermal conductivity of flexible substrates impedes efficient heat dissipation and device performance improvement. In this work, we propose a template-assisted chemical conversion strategy for obtaining boron nitride nanotube (BNNT) films with high thermal conductivity and great flexibility. Aligned carbon nanotube (CNT) films have been adopted as templates; a low-temperature chemical conversion followed by a high-temperature annealing has been carried out to produce a highly ordered BNNT film. Benefiting from the high orientation order, the BNNT film exhibits an exceptional thermal conductivity of 45.5 W m K and presents excellent heat dissipation capability, much superior to the commonly used polyimide film. Furthermore, the BNNT film demonstrated excellent flexibility and high insulation resistance. The test of integration with film resistors demonstrated its potential as a thermally conductive substrate for electronics cooling. This work provides a solution for the effective thermal management of flexible electronics.

摘要

柔性电子器件朝着高集成度、小型化和多功能化发展,导致功率密度急剧增加。然而,柔性基板的低导热率阻碍了有效的散热以及器件性能的提升。在这项工作中,我们提出了一种模板辅助化学转化策略,用于获得具有高导热率和良好柔韧性的氮化硼纳米管(BNNT)薄膜。已采用排列整齐的碳纳米管(CNT)薄膜作为模板;通过低温化学转化然后进行高温退火来制备高度有序的BNNT薄膜。得益于高取向度,BNNT薄膜展现出45.5 W m K的优异导热率,并呈现出出色的散热能力,远优于常用的聚酰亚胺薄膜。此外,BNNT薄膜表现出优异的柔韧性和高绝缘电阻。与薄膜电阻器集成的测试证明了其作为用于电子设备散热的导热基板的潜力。这项工作为柔性电子器件的有效热管理提供了一种解决方案。

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