Electronics Material and Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology , SE-412 96 Gothenburg, Sweden.
ACS Appl Mater Interfaces. 2017 May 3;9(17):14555-14560. doi: 10.1021/acsami.7b02154. Epub 2017 Apr 24.
We demonstrate the thermal conductivity enhancement of the vertically aligned carbon nanotube (CNT) arrays (from ∼15.5 to 29.5 W/mK, ∼90% increase) by encapsulating outer boron nitride nanotube (BNNT, 0.97 nm-thick with ∼3-4 walls). The heat transfer enhancement mechanism of the coaxial C@BNNT was further revealed by molecular dynamics simulations. Because of their highly coherent lattice structures, the outer BNNT serves as additional heat conducting path without impairing the thermal conductance of inner CNT. This work provides deep insights into tailoring the heat transfer of arbitrary CNT arrays and will enable their broader applications as thermal interface material.
我们通过封装外层氮化硼纳米管（BNNT，厚度为 0.97nm，具有 3-4 层壁），证明了垂直排列的碳纳米管（CNT）阵列的热导率增强（从约 15.5 到 29.5 W/mK，约增加 90%）。通过分子动力学模拟进一步揭示了同轴 C@BNNT 的传热增强机制。由于其高度一致的晶格结构，外层 BNNT 充当了额外的导热路径，而不会损害内部 CNT 的热导率。这项工作深入了解了任意 CNT 阵列的传热特性，并将使它们作为热界面材料得到更广泛的应用。
