Zhao Yujie, Sheng Qiuyue, Ke Shifeng, Wu Ruihan, He Lihua, Ren Xiaochen, Peng Boyu, Li Hanying
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, 310027, P. R. China.
Key Laboratory of Organic Integrated Circuits, Ministry of Education & Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Collaborative Innovation Center of Chemical Science and Engineering (Tianjin), Tianjin, 300072, P. R. China.
Small. 2024 Nov;20(46):e2404770. doi: 10.1002/smll.202404770. Epub 2024 Aug 6.
Fullerene (C) crystals have attracted considerable attention in the field of optoelectronic devices owing to their excellent performance as n-type semiconductor material. However, a challenge still remains unbeaten as to the continuous crystallization of non-solvated C single-crystal films with high coverage and uniform alignment using low-cost solution techniques. Here, a facile bar coating method is used to prepare ribbon-shaped non-solvated C crystals with a large area (up to centimeters) and high coverage (>95%) by precisely controlling the crystallization process from specific solvents. Benefiting from the non-solvated crystalline structure, well-distributed thickness, uniform morphological alignment, and crystallographic orientation, organic field-effect transistors fabricated from the C single-crystal films exhibit a high average electron mobility of 2.28 cm Vs, along with the coefficient of variance (CV) as small as 13.6%. This efficient manufacturing method will lay a strong foundation for C single-crystal films to fit into the future high-performance integrated optoelectronic application.
富勒烯(C)晶体因其作为n型半导体材料的优异性能,在光电器件领域引起了广泛关注。然而,利用低成本溶液技术连续结晶具有高覆盖率和均匀排列的非溶剂化C单晶薄膜仍然是一个尚未攻克的挑战。在此,通过精确控制特定溶剂中的结晶过程,采用一种简便的刮涂法制备出大面积(达厘米级)且高覆盖率(>95%)的带状非溶剂化C晶体。受益于非溶剂化晶体结构、分布均匀的厚度、形态均匀排列和晶体取向,由C单晶薄膜制成的有机场效应晶体管表现出2.28 cm² V⁻¹ s⁻¹的高平均电子迁移率,变异系数(CV)低至13.6%。这种高效的制造方法将为C单晶薄膜应用于未来高性能集成光电器件奠定坚实基础。