Lin Jiahui, Huang Jintao, Guo Zhanhu, Xu Ben Bin, Cao Yan, Ren Juanna, Hou Hua, Xiao Yongshuang, Elashiry Mustafa, El-Bahy Zeinhom M, Min Yonggang
Department of Polymeric Materials and Engineering, School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, China.
Department of Mechanical and Civil Engineering, Faculty of Engineering and Environment, Northumbria University, Newcastle Upon Tyne, NE1 8ST, UK.
Small. 2024 Nov;20(46):e2402938. doi: 10.1002/smll.202402938. Epub 2024 Aug 7.
With the rapid development of electronic industry, it's pressing to develop multifunctional electromagnetic interference (EMI) shielding materials to ensure the stable operation of electronic devices. Herein, multilayered flexible PEG@PAN/MXene (TiCT)/PVDF@SiO (PMF) composite film has been constructed from the level of microstructure design via coaxial electrospinning, coating spraying, and uniaxial electrospinning strategies. Benefiting from the effective encapsulation for PEG and high conductivity of MXene coating, PEG@PAN/MXene composite film with MXene coating loading density of 0.70 mg cm exhibits high thermal energy storage density of 120.77 J g and great EMI shielding performance (EMI SE of 34.409 dB and SSE of 49.086 dB cm g) in X-band (8-12 GHz). Therefore, this advanced composite film can not only help electronic devices prevent the influence of electromagnetic pollution in the X-band but also play an important role in electronic device thermal management. Additionally, the deposition of nano PVDF@SiO fibers (289 ± 128 nm) endowed the PMF composite film with great hydrophobic properties (water contact angle of 126.5°) to ensure the stable working of hydrophilic MXene coating, thereby breaks the limitation of humid application environments. The finding paves a new way for the development of novel multifunctional EMI shielding composite films for electronic devices.
随着电子工业的快速发展，开发多功能电磁干扰（EMI）屏蔽材料以确保电子设备的稳定运行迫在眉睫。在此，通过同轴静电纺丝、涂层喷涂和单轴静电纺丝策略，从微观结构设计层面构建了多层柔性PEG@PAN/MXene（TiCT）/PVDF@SiO（PMF）复合薄膜。得益于对PEG的有效封装和MXene涂层的高导电性，MXene涂层负载密度为0.70 mg cm的PEG@PAN/MXene复合薄膜在X波段（8 - 12 GHz）表现出120.77 J g的高热能存储密度和优异的EMI屏蔽性能（EMI SE为34.409 dB，SSE为49.086 dB cm g）。因此，这种先进的复合薄膜不仅可以帮助电子设备防止X波段电磁污染的影响，还能在电子设备热管理中发挥重要作用。此外，纳米PVDF@SiO纤维（289 ± 128 nm）的沉积赋予了PMF复合薄膜优异的疏水性能（水接触角为126.5°），以确保亲水性MXene涂层的稳定工作，从而打破了潮湿应用环境的限制。这一发现为开发用于电子设备的新型多功能EMI屏蔽复合薄膜开辟了一条新途径。
