Salam Omar Abdel, Hamad Hisham A, Eltokhy Mostafa A R, Ali Ahmed I, Son Jong Yeog, Ramzy Galal H
Electronic Technology Department, Faculty of Technology and Education, Helwan University, Saray-El Qoupa, El Sawah Street, Cairo, 11281, Egypt.
Basic Science Department, Faculty of Technology and Education, Helwan University, Saray-El Qoupa, El Sawah Street, Cairo, 11281, Egypt.
Sci Rep. 2024 Aug 20;14(1):19295. doi: 10.1038/s41598-024-63176-8.
PMMA/PEG and PMMA/PEG doped with SiO, TiO and AlO were fabricated using the solution-casting technique. The composites were characterized by X-ray diffraction and scanning electron microscopy (FE-SEM), which revealed that the amorphous nature of PMMA/PEG blend doped with AlO was hindered by the crystalline nature of those doped with SiO and TiO. The absorption of PMMA/PEG blend doped with AlO is higher, band gap energies were decreased from 4.90 eV for PMMA/PEG blend to 4.03 eV, 3.09 eV, and 2.09 eV for SiO, TiO, and AlO doped PMMA/PEG blend, respectively. The dielectric constant, ε' has a high value (2 × 10) for samples PMMA/PEG and SiO/PMMA/PEG. While dielectric loss -values decreased to < 100 for TiO/PMMA/PEG and AlO/PMMA/PEG. Further, the fabricated composite SiO/PMMA/PEG led to improvement the optical and dielectric properties compared with PMMA/PEG for optoelectronic such as manufacturing of optical fiber cables application. The results show TiO/PMMA/PEG and AlO/PMMA/PEG are multifunctional can be used as low-permittivity nanodielectric and substrates to design the next generation of flexible electronic devices.
采用溶液浇铸技术制备了聚甲基丙烯酸甲酯/聚乙二醇(PMMA/PEG)以及掺杂了二氧化硅(SiO)、二氧化钛(TiO)和氧化铝(AlO)的PMMA/PEG。通过X射线衍射和扫描电子显微镜(场发射扫描电子显微镜,FE-SEM)对复合材料进行了表征,结果表明,掺杂AlO的PMMA/PEG共混物的非晶性质受到掺杂SiO和TiO的共混物的结晶性质的阻碍。掺杂AlO的PMMA/PEG共混物的吸收更高,带隙能量从PMMA/PEG共混物的4.90电子伏特分别降至掺杂SiO、TiO和AlO的PMMA/PEG共混物的4.03电子伏特、3.09电子伏特和2.09电子伏特。对于PMMA/PEG和SiO/PMMA/PEG样品,介电常数ε'具有较高的值(2×10)。而对于TiO/PMMA/PEG和AlO/PMMA/PEG,介电损耗值降至<100。此外,与用于制造光纤电缆等光电子应用的PMMA/PEG相比,制备的复合材料SiO/PMMA/PEG改善了光学和介电性能。结果表明,TiO/PMMA/PEG和AlO/PMMA/PEG具有多功能性,可作为低介电常数纳米电介质和衬底来设计下一代柔性电子器件。