Influence of Laser Power and Rotational Speed on the Surface Characteristics of Rotational Line Spot Nanosecond Laser Ablation of TC4 Titanium Alloy.

The TC4 titanium alloy is widely used in medical, aerospace, automotive, shipbuilding, and other fields due to its excellent comprehensive properties. As an advanced processing technology, laser processing can be used to improve the surface quality of TC4 titanium alloy. In the present research, a new type of rotational laser processing method was adopted, by using a beam shaper to modulate the Gaussian spot into a line spot, with uniform energy distribution. The effects of the laser power and rotational speed on the laser ablation surface of the TC4 titanium alloy were analyzed. The results reveal that the melting mechanism of the material surface gradually changes from surface over melt to surface shallow melt with the increase in the measurement radius and the surface roughness increases first, then decreases and, finally, tends to be stable. By changing the laser power, the surface roughness changes significantly with the variation in the measurement radius. Because low laser power cannot provide sufficient laser energy, the measurement radius corresponding to the surface roughness peak of the microcrack area is reduced. Under a laser power of 11 W, the surface roughness reaches its peak when the measurement radius is 600 μm, which is 200 μm lower than that of a laser power of 12 W, 13 W, and 14 W. By changing the rotational speed, the centrifugal force generated by the rotation of the specimen affects the distribution and re-condensation of the molten pool of the surface. As the rotational speed increases, the shallow pit around the pit is made shallower by the filling of the pit with molten material and the height of the bulge decreases, until it disappears. The surface oxygen content of the material increases first and then decreases with the increase in the measurement radius and gradually approaches the initial surface state. Compared with a traditional laser processing spot, the rotational line spot covers a larger processing area of 22.05 mm. This work can be used as the research basis for rotational modulation laser polishing and has significance for guiding the innovative development of high-quality and high-efficiency laser processing technology.