• 文献检索
  • 文档翻译
  • 深度研究
  • 学术资讯
  • Suppr Zotero 插件Zotero 插件
  • 邀请有礼
  • 套餐&价格
  • 历史记录
应用&插件
Suppr Zotero 插件Zotero 插件浏览器插件Mac 客户端Windows 客户端微信小程序
定价
高级版会员购买积分包购买API积分包
服务
文献检索文档翻译深度研究API 文档MCP 服务
关于我们
关于 Suppr公司介绍联系我们用户协议隐私条款
关注我们

Suppr 超能文献

核心技术专利：CN118964589B侵权必究
粤ICP备2023148730 号-1Suppr @ 2026

文献检索

告别复杂PubMed语法，用中文像聊天一样搜索，搜遍4000万医学文献。AI智能推荐，让科研检索更轻松。

立即免费搜索

文件翻译

保留排版，准确专业，支持PDF/Word/PPT等文件格式，支持 12+语言互译。

免费翻译文档

深度研究

AI帮你快速写综述，25分钟生成高质量综述，智能提取关键信息，辅助科研写作。

立即免费体验

用于无功功率断路器的铜铬钨复合材料的微波混合烧结与焊接

Microwave Hybrid Sintering and Soldering of Cu-Cr-W Composite Material for Reactive Power Breakers.

作者信息

Savu Sorin Vasile, Ghelsingher Cristian Daniel, Ștefan Iulian, Sîrbu Nicușor-Alin, Midan Andrei-Angelo, Dumitru Ilie, Savu Ionel Dănuț, Nicolicescu Claudiu, David Andrej

机构信息

Department of Engineering and Management of Technological Systems, Faculty of Mechanics, University of Craiova, 200585 Craiova, Romania.

Doctoral School Academician Radu Voinea, Faculty of Mechanics, University of Craiova, 200585 Craiova, Romania.

出版信息

Materials (Basel). 2024 Sep 22;17(18):4648. doi: 10.3390/ma17184648.

DOI:10.3390/ma17184648
PMID:39336388
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11433303/
Abstract

Over 60% of reported failures for reactive power compensation systems are given for damage to electrical circuit breaker contacts. This paper presents a study on the development of microwave technology for sintering of W-Cu-Cr alloys at 1012 °C for 65 min using 623.38 W microwave power, as well as microwave joining at 231 °C of the W-Cu-Cr composite material on body contact using 475 W microwave power for 55 s. The joined components were subjected to mechanical and electrical tests in accordance with ICE standards to validate the applied technology. Tests of connection-disconnection of the electrical contacts were carried out in accordance with the maximum number of disconnections allowed by the manufacturer (2 cycles/min): 25 s rest time and 5 s operating time under load. The components of the electrical contact after 111237 switches were analyzed under a microscope revealing a reduction of the damaged area by 27% compared with the original contact.

摘要

超过60%报告的无功补偿系统故障是由断路器触头损坏引起的。本文介绍了一项关于微波技术发展的研究，该技术用于在1012°C下使用623.38 W微波功率烧结W-Cu-Cr合金65分钟，以及在231°C下使用475 W微波功率55秒将W-Cu-Cr复合材料在本体接触处进行微波连接。对连接后的部件按照ICE标准进行了机械和电气测试，以验证所应用的技术。电触头的连接-断开测试按照制造商允许的最大断开次数（2次循环/分钟）进行：负载下25秒休息时间和5秒操作时间。在111237次开关操作后，对电触头的部件进行显微镜分析，结果显示与原始触头相比，受损面积减少了27%。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/d7a9306b5bee/materials-17-04648-g015.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/c28322cbee3b/materials-17-04648-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/af801617e2df/materials-17-04648-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/4fa6871d9b5b/materials-17-04648-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/9733abf791c9/materials-17-04648-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/62b097c8e834/materials-17-04648-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/031b02e35b2a/materials-17-04648-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/885631990d15/materials-17-04648-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/128874ec90c5/materials-17-04648-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/86215a350d9e/materials-17-04648-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/0683ddeda1d9/materials-17-04648-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/1b9393a8a665/materials-17-04648-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/cc1d11ec3938/materials-17-04648-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/370f0c4b56a6/materials-17-04648-g013.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/894eaf85ae32/materials-17-04648-g014a.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/d7a9306b5bee/materials-17-04648-g015.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/c28322cbee3b/materials-17-04648-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/af801617e2df/materials-17-04648-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/4fa6871d9b5b/materials-17-04648-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/9733abf791c9/materials-17-04648-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/62b097c8e834/materials-17-04648-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/031b02e35b2a/materials-17-04648-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/885631990d15/materials-17-04648-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/128874ec90c5/materials-17-04648-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/86215a350d9e/materials-17-04648-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/0683ddeda1d9/materials-17-04648-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/1b9393a8a665/materials-17-04648-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/cc1d11ec3938/materials-17-04648-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/370f0c4b56a6/materials-17-04648-g013.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/894eaf85ae32/materials-17-04648-g014a.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8f99/11433303/d7a9306b5bee/materials-17-04648-g015.jpg

相似文献

1
Microwave Hybrid Sintering and Soldering of Cu-Cr-W Composite Material for Reactive Power Breakers.用于无功功率断路器的铜铬钨复合材料的微波混合烧结与焊接
Materials (Basel). 2024 Sep 22;17(18):4648. doi: 10.3390/ma17184648.
2
Microwave Soldering of Low-Resistance Conductive Joints-Technical and Economic Aspects.低电阻导电接头的微波焊接——技术与经济方面
Materials (Basel). 2023 Apr 23;16(9):3311. doi: 10.3390/ma16093311.
3
Microwave sintering of refractory metals/alloys: W, Mo, Re, W-Cu, W-Ni-Cu and W-Ni-Fe alloys.难熔金属/合金的微波烧结：钨、钼、铼、钨铜、钨镍铜和钨镍铁合金。
J Microw Power Electromagn Energy. 2010;44(1):28-44. doi: 10.1080/08327823.2010.11689768.
4
Solid-phase transient soldering method based on Au/Ni-W multilayer thin-film-modified copper-based structures.基于金/镍钨多层薄膜改性铜基结构的固相瞬态焊接方法
Heliyon. 2024 Jun 13;10(12):e33071. doi: 10.1016/j.heliyon.2024.e33071. eCollection 2024 Jun 30.
5
Effect of Microwave and Conventional Modes of Heating on Sintering Behavior, Microstructural Evolution and Mechanical Properties of Al-Cu-Mn Alloys.微波加热与传统加热方式对Al-Cu-Mn合金烧结行为、微观结构演变及力学性能的影响
Molecules. 2021 Jun 16;26(12):3675. doi: 10.3390/molecules26123675.
6
Microstructures and Properties of Cu-rGO Composites Prepared by Microwave Sintering.微波烧结制备的铜-还原氧化石墨烯复合材料的微观结构与性能
Materials (Basel). 2021 Aug 28;14(17):4899. doi: 10.3390/ma14174899.
7
Microwave sintering of W-18Cu and W-7Ni-3Cu alloys.
J Microw Power Electromagn Energy. 2009;43(1):11-6. doi: 10.1080/08327823.2008.11688598.
8
Composite Polymer for Hybrid Activity Protective Panel in Microwave Generation of Composite Polytetrafluoroethylene -Rapana Thomasiana.用于复合聚四氟乙烯-疣荔枝螺微波产生中混合活性防护板的复合聚合物
Polymers (Basel). 2021 Jul 23;13(15):2432. doi: 10.3390/polym13152432.
9
Rapid Cellulose-Mediated Microwave Sintering for High-Conductivity Ag Patterns on Paper.快速纤维素介导的微波烧结在纸上制备高导电性 Ag 图案。
ACS Appl Mater Interfaces. 2016 Aug 10;8(31):20301-8. doi: 10.1021/acsami.6b06535. Epub 2016 Aug 1.
10
On the Mechanism of Microwave Flash Sintering of Ceramics.陶瓷微波快速烧结机理研究
Materials (Basel). 2016 Aug 11;9(8):684. doi: 10.3390/ma9080684.

引用本文的文献

1
Enhanced Wear Resistance and Thermal Dissipation of Copper-Graphene Composite Coatings via Pulsed Electrodeposition for Circuit Breaker Applications.通过脉冲电沉积提高用于断路器应用的铜-石墨烯复合涂层的耐磨性和散热性
Materials (Basel). 2024 Dec 9;17(23):6017. doi: 10.3390/ma17236017.

本文引用的文献

1
Microwave Soldering of Low-Resistance Conductive Joints-Technical and Economic Aspects.低电阻导电接头的微波焊接——技术与经济方面
Materials (Basel). 2023 Apr 23;16(9):3311. doi: 10.3390/ma16093311.
2
Hydroxyapatite from Natural Sources for Medical Applications.用于医学应用的天然来源羟基磷灰石。
Materials (Basel). 2022 Jul 22;15(15):5091. doi: 10.3390/ma15155091.
3
In Situ Monitoring of Microwave Processing of Materials at High Temperatures through Dielectric Properties Measurement.通过介电性能测量对高温材料微波加工进行原位监测。
Materials (Basel). 2016 May 7;9(5):349. doi: 10.3390/ma9050349.