Zhang Xiexun, Tang Tao, Aldhaeebi Maged A, Almoneef Thamer S
College of Electronic and Information, Southwest Minzu University, Chengdu, Sichuan, 610225, China.
Department of Electrical Engineering, Prince Sattam Bin Abdulaziz University, Al-Kharj, 11942, Saudi Arabia.
Sci Rep. 2024 Oct 9;14(1):23584. doi: 10.1038/s41598-024-74676-y.
This study presents an innovative method for designing a 3D packaged wideband bandpass filter (BPF) by vertically integrating a high-pass filter (HPF) and a low-pass filter (LPF) using an air cavity and vertical interconnect accesses (VIAs). This integration enhances performance while significantly reducing system size. The fabricated BPF, constructed on multilayer substrates, achieves a passband from 2.175 to 4.2 GHz with less than 2.5 dB insertion loss and a return loss exceeding 10 dB. The design utilizes a partial substrate integrated suspended line (SISL) structure, enabling precise control over the equivalent dielectric constant and characteristic impedance to optimize insertion loss. The height of the air cavity, determined through theoretical analysis and S-parameter inversion, is critical for achieving optimal filter performance. The methodology allows for independent circuit designs on each layer, resulting in a 3D assembly. This refined approach makes it easier to produce compact bandpass and multi-band filters, simplifying circuit development and enabling scalable fabrication. This design is versatile across different frequency ranges, demonstrating significant practical and theoretical benefits.
本研究提出了一种创新方法，通过使用空气腔和垂直互连通孔（VIA）将高通滤波器（HPF）和低通滤波器（LPF）垂直集成，来设计3D封装宽带带通滤波器（BPF）。这种集成提高了性能，同时显著减小了系统尺寸。在多层基板上制造的BPF，通带为2.175至4.2 GHz，插入损耗小于2.5 dB，回波损耗超过10 dB。该设计采用部分基板集成悬置线（SISL）结构，能够精确控制等效介电常数和特性阻抗，以优化插入损耗。通过理论分析和S参数反演确定的空气腔高度，对于实现最佳滤波器性能至关重要。该方法允许在每一层上进行独立的电路设计，从而形成3D组件。这种改进的方法使得更容易生产紧凑的带通和多频段滤波器，简化了电路开发并实现了可扩展制造。该设计在不同频率范围内具有通用性，展现出显著的实际和理论优势。
