Pappas D P, David D E, Lake R E, Bal M, Goldfarb R B, Hite D A, Kim E, Ku H-S, Long J L, McRae C R H, Pappas L D, Roshko A, Wen J G, Plourde B L T, Arslan I, Wu X
National Institute of Standards and Technology, Boulder, Colorado 80305, USA.
CIRES, University of Colorado, Boulder, Colorado 80309, USA.
Appl Phys Lett. 2018;112(18). doi: 10.1063/1.5027104.
We show that electroplated Re films in multilayers with noble metals such as Cu, Au, and Pd have an enhanced superconducting critical temperature relative to previous methods of preparing Re. The dc resistance and magnetic susceptibility indicate a critical temperature of approximately 6 K. The magnetic response as a function of field at 1.8 K demonstrates type-II superconductivity, with an upper critical field on the order of 2.5 T. Critical current densities greater than 10 A/m were measured above liquid-helium temperature. Low-loss at radio frequency was obtained below the critical temperature for multilayers deposited onto resonators made with Cu traces on commercial circuit boards. These electroplated superconducting films can be integrated into a wide range of standard components for low-temperature electronics.
我们表明，与之前制备铼的方法相比，在与铜、金和钯等贵金属形成的多层结构中电镀的铼膜具有更高的超导临界温度。直流电阻和磁化率表明临界温度约为6K。在1.8K下，作为磁场函数的磁响应表明为II型超导，上临界场约为2.5T。在液氦温度以上测量到临界电流密度大于10A/m。对于沉积在商用电路板上带有铜迹线的谐振器上的多层膜，在临界温度以下获得了低射频损耗。这些电镀超导膜可集成到用于低温电子学的各种标准组件中。
